TSMC's 1.6nm-Class A16 Process Enters Volume Production

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• Semiconductors09/23/2026@TechDesk

  TSMC Starts Volume Production of 2nm (N2) Chips in Kaohsiung

  TSMC·…TSMC Fab22 P1, 園區北路, Nanzi District, Kaohsiung 811, Taiwan

  Starts 12/31/2025ESTIMATED73% CONFIDENCE266 days agoTSMC's^[1][2] 2nm page says N2 "has started volume production in 4Q25 as planned" and its 2025 annual report that it "entered high volume manufacturing in 4Q'25"; neither names the day, so the quarter's last day stands in.

  TSMC's first nanosheet-transistor node, N2, entered volume production in the fourth quarter of 2025 as planned, starting at Fab 22 in Kaohsiung, with Fab 20 in Hsinchu as its second 2nm fab.

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• Semiconductors09/23/2026@TechDesk

  TSMC's Third Arizona Fab Starts Volume Production on N2 and A16

  TSMC·…P3, TSMC Arizona Fab 21, F Road, North Gateway, Phoenix, Maricopa County, Arizona 85085, United States

  Starts 12/31/2029ESTIMATED58% CONFIDENCEin 3.3 yearsTSMC's^[1][4] Arizona page gives only a span: "Third Fab: In April 2025, TSMC broke ground on the site of the third fab, slated for N2 and A16 process technologies. Targeting volume production by the end of the decade." - so the decade's last day, estimated.

  The third fab on TSMC's north Phoenix campus, where ground was broken in April 2025, is slated for its 2nm (N2) and A16 processes and targeted for volume production by the end of the decade - the most advanced chipmaking TSMC has committed to the United States.

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• Semiconductors09/23/2026@TechDesk

  TSMC's Second Kumamoto Fab (JASM) Starts 3nm Volume Production

  TSMC·…JASM, Haramizu, Kikuyo, Kikuchi County, Kumamoto Prefecture 869-1103, Japan

  Starts 12/31/2028ESTIMATED12 months late71% CONFIDENCEin 2.3 yearsOnly a year is given: Taiwan's MOEA says the fab is "scheduled to start installing equipment and come online in 2028", and C.C. Wei said on the 16 April 2026 call that "commercial production is scheduled to begin in 2028" - so the year's last day, estimated.^[1]

  JASM's second fab in Kikuyo, Kumamoto - switched from 6nm-class chips to TSMC's 3nm process - is due to start volume production in 2028 at 15,000 12-inch wafers a month, making Japan's first 3nm chips about a year after the end-2027 start TSMC first promised.

  $17B

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• Semiconductors06/21/2017@ThePinGang

  In December last year TSMC started to work on its 5nm process

  TSMC

  

  Starts 03/31/2020CONFIRMED79% CONFIDENCE6.5 years agoHappened as dated, per hexus.net^[1]: "…progress of these plans, with a target launch date set for H1 2020. Now a recent report suggests th…"

  In December last year TSMC started to work on its 5nm process. In the following January we heard from the firm's CEO about the progress of these plans, with a target launch date set for H1 2020. Now a recent report suggests that TSMC is confident of reaching its previously publicised goals, as it has started to allocate between 300 and 400 R&D staff to work on developing its 3nm process.

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• Semiconductors09/23/2026@TechDesk

  TSMC 2026 North America Technology Symposium in Santa Clara

  TSMC·…Santa Clara Convention Center, 5001 Great America Parkway, Santa Clara, CA 95054, United States

  Starts 04/22/2026 3:30PMCONFIRMED85% CONFIDENCE154 days agoTSMC's^[1] release is datelined "SANTA CLARA, CA, Apr. 22, 2026" and says it "today debuted" A13 at the symposium; GUC's event page gives "8:30 a.m. - 5:30 p.m. (PDT, UTC-7)" at the Santa Clara Convention Center.

  TSMC's largest annual customer event opened its 2026 series at the Santa Clara Convention Center on 22 April, where it debuted the A13 process, previewed A12 and introduced N2U.

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• Semiconductors09/20/2026@BuildDesk

  TSMC's Second Arizona Fab Starts Mass Production

  TSMC Arizona campus, N 43rd Avenue at W Dove Valley Road, Phoenix, AZ 85085TSMC

  

  Starts 07/01/2027ESTIMATED72% CONFIDENCEin 281 daysTSMC^[2] said it had "pushed up the mass production schedule for its second wafer fab in the U.S. state of Arizona to the second half of 2027 from the previously planned 2028," naming a half-year rather than a day.

  The second fab on TSMC's north Phoenix campus, whose structure was finished in 2025, is due to begin high-volume manufacturing in the second half of 2027 - a year earlier than the schedule the company had previously given. Chairman C.C. Wei gave the pulled-forward date on 15 January 2026; the campus is the centrepiece of a $165 billion Arizona investment.

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• Semiconductors09/23/2026@TechDesk

  TSMC's Dresden Fab (ESMC) Starts Production

  TSMC·…European Semiconductor Manufacturing Company (ESMC) GmbH, Robert-Bosch-Ring, Hellerau/Wilschdorf, 01109 Dresden, Saxony, Germany

  Starts 12/31/2027ESTIMATED73% CONFIDENCEin 1.3 yearsTSMC's^[1][6] founding release gives a bound, not a day: "production targeted to begin by the end of 2027"; at the September 2026 topping-out the partners still said production starts in 2027 and Hardwareluxx^[3] reported tool installation "bis Ende 2027", after which the first chips follow - so 31 December 2027, estimated.

  ESMC, TSMC's EUR 10 billion joint venture with Bosch, Infineon and NXP, is due to start production at its Dresden fab by the end of 2027 - Europe's first FinFET-capable foundry, making 28/22nm and 16/12nm chips mainly for cars and industry.

  €10B

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• Semiconductors09/23/2026@LawDesk

  Taiwan Indicts Three Engineers Over the Theft of TSMC's 2nm Secrets

  Intellectual Property Branch, Taiwan High Prosecutors Office, 164 Bo'ai Road, Zhongzheng District, Taipei 100006, Taiwan

  Starts 08/27/2025CONFIRMED85% CONFIDENCE1.1 years agoThe Intellectual Property Branch's own release, posted 114-08-27 (27 August 2025), says the case against the three detained defendants 'was concluded today (27th)' ('於今（27）日偵查終結') and an indictment filed; no time is given, so it is an all-day date.^[1]

  Prosecutors charged former TSMC engineer Chen Li-ming, by then at Tokyo Electron's Taiwan unit, and two serving TSMC engineers with stealing 2nm trade secrets, seeking 14, 9 and 7 years in Taiwan's first indictment for theft of a national core key technology.

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• Semiconductors09/23/2026@TechDesk

  TSMC Q2 2026 Results: Record $40.2B Revenue, Capex Raised to $60-64B

  TSMC·…Mandarin Oriental Taipei, 158 Dunhua North Road, Songshan District, Taipei 10548, Taiwan

  Starts 07/16/2026 6:00AMCONFIRMED86% CONFIDENCE69 days agoTSMC's^[1][2] release, datelined "HSINCHU, Taiwan, R.O.C., Jul. 16, 2026", says TSMC "today announced" its second-quarter results, and the call transcript TSMC posts gives "EVENT DATE/TIME: JULY 16, 2026 / 6:00AM GMT" (2 p.m. Taiwan time, as the FTNN report of TSMC's schedule says: "16日下午2時").

  TSMC reported second-quarter revenue of US$40.20 billion, up 33.7% from a year earlier, a 67.7% gross margin and record net income of NT$706.56 billion, guided Q3 revenue to US$44.6-45.8 billion and raised its 2026 capital budget to US$60-64 billion.

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• Mining09/15/2026@BuildDesk

  Polymetal Installs Its Record 1,100-Tonne Gold Autoclave at Amursk

  Amursk, Khabarovsk Krai, RussiaPolymetal International

  

  Starts 08/17/2020CONFIRMED87% CONFIDENCE6.1 years agoInternational Mining reported on 17 August 2020 that Polymetal's 1,100-tonne autoclave vessel had been installed on schedule at the Amursk POX-2 site.^[1]

  Belgian engineering firm Coek Engineering built the world's largest gold-processing autoclave, a 1,100-tonne titanium-lined pressure vessel, and shipped it 25,000 km from Antwerp to Polymetal's Amursk POX-2 plant in Russia's Far East. The vessel was installed on schedule in August 2020.

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• Transport09/15/2026@BuildDesk

  Scheuerle Debuts the Self-Propelled Modular Transporter

  Scheuerle Fahrzeugfabrik, Pfedelbach, GermanyScheuerle Fahrzeugfabrik

  

  01/01/1983 - 12/31/1983ESTIMATED65% CONFIDENCE43.7 years agoTII Group’s^[3] own "an invention turns 40" retrospective names 1983 as the year Scheuerle developed and launched the SPMT, but gives no specific day.

  German heavy-vehicle maker Scheuerle Fahrzeugfabrik developed and launched the Self-Propelled Modular Transporter (SPMT), the modular, multi-axle hauler that became the industry standard for moving exceptionally heavy loads. Its name is now used generically across the heavy-transport industry.

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• Semiconductors08/02/2017@ThePinGang

  New iPad Pro's A10X Chip Revealed as First Manufactured Using TSMC's 10nm Process

  Apple·…

  

  Starts 06/13/2017CONFIRMED78% CONFIDENCE9.3 years agoHappened as dated, per macrumors.com^[1][5]: "…ured Using TSMC's 10nm Process With the launch of the new iPad Pro models at WWDC this year, Apple i…"

  With the launch of the new iPad Pro models at WWDC this year, Apple introduced new 10.5-inch and 12.9-inch devices that both came with an A10X Fusion Chip, which is said to deliver 30 percent faster CPU performance than previous-generation iPad Pro models and 40 percent faster graphics performance. In comparison, the A9 and A10 were built using a 16-nanometer process, the A8 used a 20-nanometer process, and the A7 used a 28-nanometer process.

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