The first entry is always the pin's source. Overall confidence is a weighted average of how firmly each reference supports the start and end times used above; a reference counts half as much for every 180 days older than the newest.
TSMC's[6] founding release gives a bound, not a day: "production targeted to begin by the end of 2027"; at the September 2026 topping-out the partners still said production starts in 2027 and Hardwareluxx[3] reported tool installation "bis Ende 2027", after which the first chips follow - so 31 December 2027, estimated.
CNA from the 14 September 2026 topping-out: Christian Koitzsch says construction is on schedule and within budget and names the installation of the first process equipment in the second half of 2027 as the next milestone, after the cleanroom interior, material handling and utilities are finished.[1]
Hardwareluxx: installation of the production equipment now begins and is to be finished by the end of 2027, when the first chips should come off the line; 300mm wafers, about 2,000 staff.
dpa: the joint venture 'liegt im Zeitplan'; production equipment goes into the cleanrooms in the second half of 2027, and ESMC will make chips down to 12nm, halfway to the goal according to managing director Ching-Kun Huang.[1]
Dresden tech reporter Heiko Weckbrodt says production is to start in mid-2027 - earlier than the other accounts - and describes the site infrastructure (new power lines, substations, an industrial water network) the city and state are building around the fab.[1]
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