Pins matching tag:Semiconductors

NVIDIA's revenue more than doubled from a year earlier to a record $96.2 billion for the quarter ended 26 July 2026, with Data Center at $89.0 billion, and it guided the third quarter to $108 billion.

The West Lafayette project targets a cleanroom by October 2028 and HBM mass production in the second half of 2029, with about 1,000 operating staff.

At a Deutsche Bank conference, CFO Dave Zinsner said customer discussions on 14A had moved from evaluating the process to how much capacity Intel can supply. He announced no formal engagement but said Intel has conviction it will win external 14A customers.

Broadcom's revenue rose 86% to a record $29.6 billion for the quarter ended 2 August 2026, with AI semiconductor revenue up 221% to $16.7 billion, and Hock Tan said Anthropic is on track to become its largest XPU customer in 2027.

Qualcomm will build customised AI inference silicon and up-to-1.6T optical connectivity for Amazon's data centres over several generations, and gave Amazon a warrant for up to 25 million Qualcomm shares vesting against up to $60 billion of purchases.

ESMC marked its Dresden fab topping-out on September 14, 2026. Cleanroom installation and first tools remain planned for late 2027.

On CNBC's "Mad Money", Hock Tan said Broadcom's forecasts of $115 billion in AI revenue for fiscal 2027 and $230 billion for 2028 are unchanged, after Dario Amodei's essay urging a slower pace of AI development sent Broadcom shares down 4.8%.

Judge Maryellen Noreika heard two days of evidence, without a jury, on whether the five-year royalty-free provisions in the Qualcomm-Arm contracts can be enforced, ahead of the jury trial of Qualcomm's suit against Arm.

In its first peer-reviewed benchmark, NVIDIA's Vera Rubin NVL72 rack posted up to 3.7x the throughput of GB300 NVL72 on Qwen3-VL and 2.5x on DeepSeek-R1, submitted in the preview category of MLCommons' MLPerf Inference v6.1 round.

Jensen Huang told reporters at a summit with King Charles III in Scotland that he expects Nvidia to sell twice as many chips next year as this year, citing AI demand in almost every country. Nvidia does not disclose total chip counts.

On 17 September 2026 Texas Instruments said it will lift its quarterly dividend from US$1.42 to US$1.52 a share (US$6.08 a year), payable 10 November 2026 to holders of record on 30 October 2026.

Qualcomm's Snapdragon Summit 2026 ran 22-24 September in Maui under the theme 'Snapdragon for the Agentic Age', launching the 2 nm Snapdragon 8 Elite Extreme Gen 6 and 8 Elite Gen 6, Snapdragon Sound Elite Gen 2 and Linux support for Snapdragon X2 PCs.

Qualcomm unveiled two flagship phone chips at Snapdragon Summit 2026 - the Snapdragon 8 Elite Extreme Gen 6 and 8 Elite Gen 6 - on a 2 nm process with 5 GHz Oryon cores, the X105 modem and Wi-Fi 8, for phones from Xiaomi, OnePlus, OPPO, vivo, Honor and Motorola.

TSMC's 18th Open Innovation Platform Ecosystem Forum brings chip designers, EDA and IP partners and customers to the Santa Clara Convention Center on 23 September, opening a global series that ends in Israel in December.

Qualcomm launched Snapdragon Sound Elite Gen 2 at Snapdragon Summit 2026, an audio-wearable platform with twice its predecessor's AI capability, micro-power Wi-Fi 6E for direct-to-cloud assistants and support for camera-equipped earbuds and audio glasses.

On 28 September 2026 AMD announced a definitive agreement to acquire World Labs, the spatial-intelligence AI lab led by Fei-Fei Li, in an all-stock deal valued at about US$8.2 billion. Li will become AMD executive vice president and chief scientist; closing is expected by the end of 2026.

Arizona Public Service says TSMC is committed to 12 facilities in north Phoenix, a $265 billion total, and, on its 4 August 2026 call, that TSMC's earlier $165 billion commitment alone was over 1 GW of demand; APS said it would file its integrated resource plan by the end of October 2026 with the full TSMC buildout, but no total MW for the $265 billion is published.

Qualcomm's breach-of-contract and interference case against Arm is set for a jury trial before Judge Maryellen Noreika in Wilmington, seven months later than first scheduled.

GlobalFoundries was selected to operate two new Malta, New York fabs under a U.S.–Japan initiative providing up to US$21 billion. Japan supplies the investment; GlobalFoundries supplies technology and operations. The first fab is expected online in 2029.

TSMC reports third-quarter 2026 results and gives its fourth-quarter outlook at its earnings conference on Thursday 15 October at 2 p.m. Taiwan time, against its own guidance of US$44.6-45.8 billion in revenue and a 65-67% gross margin.

Reuters reports that Cristiano Amon’s October 19 memo outlined performance-focused global reductions after annual reviews. The affected headcount and restructuring charge were not disclosed; notifications are due to begin in November.

The US Court of Appeals for the Third Circuit has listed Arm's appeal of the Delaware judgment for Qualcomm and Nuvia on the merits in Philadelphia, with oral argument at the panel's discretion.

Intel's Q3 2026 release says it released the Intel 14A 0.9 PDK in October. On the call Lip-Bu Tan said the 1.0 PDK should come by Q1 2027 and that multiple potential 14A customers are progressing but cannot yet be named. CFO Zinsner said 14A is being prepared for risk production in 2027 and production in 2028.

Qualcomm is expected to report fourth-quarter and full fiscal 2026 results, guided at $9.7-10.5 billion of revenue, the first report since its price increases took effect.

NVIDIA reports its third quarter of fiscal 2027 against its own guide of $108 billion in revenue, the quarter in which Vera Rubin is expected to reach about a fifth of Data Center sales.

Terafab's full-scale chip plant is due to start construction on 1 December 2026 at the former Gibbons Creek power station site in Grimes County, Texas, with completion planned by the end of 2028 and an initial $16.8 billion investment.

Broadcom reports its fourth quarter and fiscal year 2026 against its own guide of about $34.8 billion in revenue, up 93%, including $21.7 billion of AI semiconductor revenue.

The first deployment of Jalapeño, the inference accelerator OpenAI designed and Broadcom builds under their 10 GW deal, due by the end of 2026 in data centers with Microsoft and other partners, ahead of a planned 1.3 GW in 2027.

Huang expects Nvidia to sell twice as many chips in 2027 as in 2026, the unit-growth projection behind the roughly 70% fiscal 2028 revenue guide.

Nvidia expects roughly 70% revenue growth during fiscal 2028, with chip supply constraining demand. The forecast covers the fiscal year beginning February 1, 2027 and ending January 30, 2028, rather than the August 2026 earnings call on which it was announced.

Intel's Nova Lake desktop chips, branded Core Ultra 400, are reported to launch from Q1 2027 on the new LGA-1954 socket, with a 52-core flagship following later in 2027.

Reported, not announced by Intel: Razor Lake is expected in Q4 2027 with Griffin Cove P-cores and Golden Eagle E-cores, pin-to-pin compatible with Nova Lake's LGA 1954, followed by Titan Lake by the end of 2028 and E-core-only Moon Lake around 2028.

A16, TSMC's first node with Super Power Rail backside power delivery, is expected to reach volume production in 2027, a year after the 2026 production TSMC planned when it unveiled the node.

Qualcomm's second-generation data-center AI accelerator, the Dragonfly AI250, is due in 2027 with High Bandwidth Compute near-memory stacking that gives 133 TB/s of effective bandwidth per card, 18 times the AI200.

ESMC, TSMC's EUR 10 billion joint venture with Bosch, Infineon and NXP, is due to start production at its Dresden fab by the end of 2027 - Europe's first FinFET-capable foundry, making 28/22nm and 16/12nm chips mainly for cars and industry.

Micron's up to $100 billion, four-fab Clay, New York campus is projected to use about 16 billion kWh (16 TWh) a year at full buildout, served by National Grid through an expanded Clay substation and eight underground 345 kV lines; first-fab operations are now expected in 2030.

AEP Ohio built the Green Chapel 138 kV station in Licking County, Ohio, for a chip-fab customer requiring 440 MW at first and up to 1,560 MW at peak; Intel's $28 billion Ohio One fab has slipped to 2030-2031 for the first module, so the substation sits unused and AEP Ohio and Meta have asked to use it temporarily.