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CNBC (24 June 2026) reports the companies "are aiming for initial deployment of the Jalapeño chips by the end of 2026", and the release says "designed for initial deployment by the end of 2026", so the pin takes that period's last day; Tan expects "small prototype development" in late 2026, and no deployment had been reported by 23 September 2026.
Broadcom's 2 September 2026 call: "In Q3, we also shipped Jalapeno", "Shipments of Jalapeno for OpenAI will continue" in Q4, and it is on track for the planned 1.3 GW deployment in 2027.[1]
OpenAI's Hot Chips presentation of the deployable system: HBM4, 700W, 128 accelerators per rack, 2,048 per pod, Tomahawk 6, Celestica hardware.[1]
Full wire copy of the release, published Jun 24, 2026 9:00am EDT, with the 'initial deployment by the end of 2026' wording and Hock Tan's Microsoft quote.[1]
Independent coverage: nine-month tape-out, deployment beginning in late 2026, Microsoft named as a deployment partner.[1]
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