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- Dec 31, 202780% CONFIDENCEfrom qualcomm.com
Qualcomm's Dragonfly AI250 With High Bandwidth Compute Due in 2027
- Qualcomm expects the Dragonfly AI250 to be commercially available in 2027, with commercial sampling of its HBC Gen 1 memory technology in mid-2027[2][3]
- It is the second generation in Qualcomm's annual-cadence data-center accelerator roadmap, between AI200 (2026) and AI300 (sampling 2028)[2]
Notable features
- Qualcomm High Bandwidth Compute Gen 1: compute bonded to 3D-stacked memory, 133 TB/s of effective bandwidth per card, 18x AI200[1][2]
- 768 GB of memory per card; models up to 10 trillion parameters and 1 million-token contexts[1]
- 4x-8x better performance per watt than contemporary GPU designs on memory bandwidth per watt per card[1]
- Air- and direct-liquid-cooled ORv3 rack for disaggregated inference[1]
References 466% CONFIDENCE
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- [1]50%qualcomm.com/data-center/products/qualcomm-dragonfly-ai250qualcomm.com· Posted Sep 25, 2026· Starts Dec 31, 2027· 44% of score
The October 2025 launch release says AI250 is 'expected to be commercially available in ... 2027', and the June 2026 roadmap expects 'Commercial sampling of HBC Gen 1 with AI250 ... in mid-2027'; a bare year is dated to 31 December.
- [2]80%Qualcomm Unveils Comprehensive Data Center Roadmap ... Qualcomm Dragonfly Portfolio (Qualcomm)qualcomm.com· Published Jun 24, 2026· 31% of score
'Commercial sampling of HBC Gen 1 with AI250 is expected in mid-2027'; AI250 reaches 133 TB/s per card, 18x AI200.[1]
- [3]80%Qualcomm Unveils AI200 and AI250 (Qualcomm)qualcomm.com· Published Oct 27, 2025· Starts Dec 31, 2027 ✓· 12% of score
'Qualcomm[1][2] AI200 and AI250 are expected to be commercially available in 2026 and 2027 respectively.'
- [4]72%Qualcomm announces AI chips to compete with AMD and Nvidia (CNBC)cnbc.com· Published Oct 27, 2025· 12% of score
'the AI250, planned for 2027'.[1]
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