Pins matching company:Intel

Offers more than 100 GFLOPS of inference performance within a 1W power envelope.

Intel plans to move up the launch of its 14-nanometer Coffee Lake processors, introducing them in August of 2017 instead of January 2018. According to DigiTimes, the launch is being moved up because of "increasing competition from AMD's Ryzen 7 and Ryzen 5 processors."

Coffee Lake (14 nm++) launched October 5, 2017 with six-core Core i7-8700K ($359) and, as the 9th-gen Refresh announced October 8, 2018, eight-core Core i9-9900K ($488).

Intel and AMD are joining forces to produce new 8th-Generation H-Series Intel mobile processors paired with stacked second-generation High Bandwidth Memory and custom-built discrete graphics from AMD. For the new H-Series chips, which feature all of the above listed components in a single processor package, Intel says is using its Embedded Multi-Die Interconnect Bridge (EMIB), a power-sharing framework that reduces the standard silicon footprint to less than half that of standard discrete components on a motherboard. This is the first consumer product that takes advantage of EMIB.

Cannonlake Processors will be 15% faster than the Kaby Lake ones, 10nm FinFET Manufacturing Process, Chipset of 200 Series, USB 3.1 Gen 2 10Gbps support, 6 ports, Thermal Design Power (TDP) up to 95 W (LGA 1151), Updated Intel Optane Technology Support

Comet Lake mobile chips were announced August 21, 2019 and desktop chips arrived April 30, 2020 on 14 nm++, topped by the 10-core Core i9-10900K (5.3 GHz max turbo, $488) on LGA 1200.

On December 16, 2019 Intel announced it had acquired Israeli AI chip maker Habana Labs for about $2 billion, adding the Gaudi training and Goya inference processors to its data-center AI portfolio.

5G promises greater speed, higher capacity, and low latency to our essential high-tech smart connected devices. Intel wants to make the transition to 5G smooth and seamless and with this in mind has designed a powerful end-to-end 5G solution. The Intel XMM 8000 series is Intel's first family of commercial 5G multi-mode modems, operating in both sub-6GHz and millimetre wave global spectrum bands. Intel hopes to gather a mass of design wins for the XMM 8000 in PC, phones, and even vehicles.

On March 23, 2021 Intel CEO Pat Gelsinger announced IDM 2.0: keep most chips in Intel fabs, use outside foundries for some tiles, and launch Intel Foundry Services, backed by two new Arizona fabs at about $20 billion.

Rocket Lake-S went on sale March 30, 2021, backporting the 10 nm Sunny Cove design to 14 nm++ as Cypress Cove, topped by the 8-core Core i9-11900K ($539) with PCIe 4.0 and Xe graphics.

Alder Lake launched November 4, 2021 on Intel 7 with Golden Cove performance and Gracemont efficiency cores, Thread Director, DDR5 and PCIe 5.0 on LGA 1700; the Core i9-12900K had 8P+8E cores at $589.

Intel's first Arc desktop graphics cards went on sale on October 12, 2022: the Arc A770 from $329 and the Arc A750 at $289, taking on Nvidia's GeForce RTX 3060 on price and performance per dollar.

Raptor Lake reached shops October 20, 2022 (13th gen) and was refreshed October 17, 2023 (14th gen); the i9-13900K and i9-14900K have 8P+16E cores at $589, and 2024 saw Vmin-shift crashes, microcode fixes and a two-year warranty extension.

Mobileye began trading on Nasdaq on October 26, 2022 after pricing 41 million Class A shares at $21, raising about $861 million gross at a valuation near $17 billion; Intel kept control.

Intel's Core Ultra launch (Meteor Lake) on December 14, 2023 brought the first client chiplet design on Foveros packaging, built on Intel 4, with Intel's first client NPU and the new Core Ultra brand.

Intel introduced the Gaudi 3 AI accelerator on April 9, 2024 at Intel Vision, a 5 nm part with 24 on-board 200 Gb Ethernet ports that Intel pitched against Nvidia's H100 for enterprise generative AI.

Lunar Lake (Core Ultra 200V) shipped September 24, 2024 with a TSMC N3B compute tile, 4 Lion Cove P-cores and 4 Skymont E-cores, on-package LPDDR5X, Xe2 graphics and a 48 TOPS NPU that meets Microsoft's Copilot+ bar.

Arrow Lake-S launched October 24, 2024 as the Core Ultra 9 285K (8P+16E, $589, no Hyper-Threading, LGA 1851) with a TSMC N3B compute tile after Intel cancelled 20A; reviews were mixed.

At Intel Foundry Direct Connect, Intel said it had engaged lead customers on Intel 14A, the successor to 18A, had sent them an early process design kit, and that several planned test chips on the node. 14A adds PowerDirect direct-contact power delivery on top of 18A's PowerVia.

With Q2 2025 results on 24 July 2025, CEO Lip-Bu Tan wrote that 'there are no more blank checks' and that the 14A build-out depends on confirmed customer commitments, tying the node's future to landing an external anchor customer.

Panther Lake (Core Ultra Series 3) launched at CES in January 2026 as the first client CPU on Intel 18A, up to 16 cores, Xe3 graphics up to 12 Xe cores and a 50 TOPS NPU; the Core Ultra X9 388H leads.

On its Q2 2026 earnings call, CEO Lip-Bu Tan said 14A risk production for internal products is now planned for the second half of 2027, with high-volume production in 2028, about a year earlier than the 2028 and 2029 plan.

At a Deutsche Bank conference, CFO Dave Zinsner said customer discussions on 14A had moved from evaluating the process to how much capacity Intel can supply. He announced no formal engagement but said Intel has conviction it will win external 14A customers.

Intel's Q3 2026 release says it released the Intel 14A 0.9 PDK in October. On the call Lip-Bu Tan said the 1.0 PDK should come by Q1 2027 and that multiple potential 14A customers are progressing but cannot yet be named. CFO Zinsner said 14A is being prepared for risk production in 2027 and production in 2028.

Intel's Nova Lake desktop chips, branded Core Ultra 400, are reported to launch from Q1 2027 on the new LGA-1954 socket, with a 52-core flagship following later in 2027.

Reported, not announced by Intel: Razor Lake is expected in Q4 2027 with Griffin Cove P-cores and Golden Eagle E-cores, pin-to-pin compatible with Nova Lake's LGA 1954, followed by Titan Lake by the end of 2028 and E-core-only Moon Lake around 2028.

AEP Ohio built the Green Chapel 138 kV station in Licking County, Ohio, for a chip-fab customer requiring 440 MW at first and up to 1,560 MW at peak; Intel's $28 billion Ohio One fab has slipped to 2030-2031 for the first module, so the substation sits unused and AEP Ohio and Meta have asked to use it temporarily.