UNVERIFIEDDate confidence: UNVERIFIEDNo wording about the date was foundHow firmly the source words the date: confirmed, scheduled, estimated, delayed or unverified.Show all UNVERIFIED pins40% CONFIDENCEOverall confidence: 40%How well the pin's source and references back up its dates.Weighted average of how firmly 4 references, the source included, support the pin's start and end times; a reference counts half as much for every 180 days older than the newestShow all pins at 49% confidence or below
16Gbps GDDR5X speeds achieved. On track for GDDR6 mass production in Q1 2018.
CONFIRMEDDate confidence: CONFIRMEDStated as firmHow firmly the source words the date: confirmed, scheduled, estimated, delayed or unverified.Show all CONFIRMED pins77% CONFIDENCEOverall confidence: 77%How well the pin's source and references back up its dates.Weighted average of how firmly 4 references, the source included, support the pin's start and end times; a reference counts half as much for every 180 days older than the newestShow all pins at 75% confidence or better
Happened as dated, per macrumors.com[1]: "…nes that use the new technology will be released in the first quarter of 2018. Get weekly top MacRum…"
Intel and AMD are joining forces to produce new 8th-Generation H-Series Intel mobile processors paired with stacked second-generation High Bandwidth Memory and custom-built discrete graphics from AMD. For the new H-Series chips, which feature all of the above listed components in a single processor package, Intel says is using its Embedded Multi-Die Interconnect Bridge (EMIB), a power-sharing framework that reduces the standard silicon footprint to less than half that of standard discrete components on a motherboard. This is the first consumer product that takes advantage of EMIB.
