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Focus Taiwan: "A topping out ceremony was held Monday at the site" (dateline Sept. 14, "The ceremony, held on Sept. 14"); dpa's preview gave the time: ESMC "feiert ... am Montag (12.00 Uhr) mit einem Richtfest den Abschluss des Rohbaus" - noon CEST, 10:00 UTC.
Evertiq (citing MDR Sachsen) reports the shell complete about two years after construction began, around EUR 10 billion invested (EUR 5 billion from the federal government), 2,000 jobs, chips down to 12 nm and a production start planned for 2027.
Hardwareluxx dates the topping-out to 14 September 2026 with Koitzsch and Kretschmer present, and says tool installation is to be finished by the end of 2027, when the first chips should come off the line; TSMC 70%, Bosch, Infineon and NXP 10% each.
dpa's report from the ceremony: ESMC president Christian Koitzsch called it a milestone, more than 2,000 workers assembled about 30,000 precast concrete elements since the August 2024 groundbreaking, managing director Ching-Kun Huang said the project is halfway, and production equipment goes into the cleanrooms in the second half of 2027; EUR 10 billion investment with EUR 5 billion federal aid.[1]
dpa's same-morning preview gives the ceremony's time - Monday at 12:00 - with Minister-President Michael Kretschmer among the guests, and repeats the EUR 10 billion investment and 2027 production start.[1]
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