Épingles correspondant à company:TSMC

In December last year TSMC started to work on its 5nm process. In the following January we heard from the firm's CEO about the progress of these plans, with a target launch date set for H1 2020. Now a recent report suggests that TSMC is confident of reaching its previously publicised goals, as it has started to allocate between 300 and 400 R&D staff to work on developing its 3nm process.

TSMC's first nanosheet-transistor node, N2, entered volume production in the fourth quarter of 2025 as planned, starting at Fab 22 in Kaohsiung, with Fab 20 in Hsinchu as its second 2nm fab.

A memorandum signed in Washington commits Taiwanese chipmakers such as TSMC to at least $250 billion of new US investment plus $250 billion in Taiwan credit guarantees, in return for a 15% tariff cap and Section 232 chip-tariff exemptions for companies building US fabs.

TSMC's largest annual customer event opened its 2026 series at the Santa Clara Convention Center on 22 April, where it debuted the A13 process, previewed A12 and introduced N2U.

TSMC reported second-quarter revenue of US$40.20 billion, up 33.7% from a year earlier, a 67.7% gross margin and record net income of NT$706.56 billion, guided Q3 revenue to US$44.6-45.8 billion and raised its 2026 capital budget to US$60-64 billion.

Twenty-five months after its groundbreaking, ESMC - TSMC's joint venture with Bosch, Infineon and NXP - celebrated the topping-out of its roughly EUR 10 billion chip fab in Dresden, TSMC's first in Europe. The shell is finished; cleanroom fit-out follows, with the first process tools due in the second half of 2027.

TSMC's 18th Open Innovation Platform Ecosystem Forum brings chip designers, EDA and IP partners and customers to the Santa Clara Convention Center on 23 September, opening a global series that ends in Israel in December.

TSMC reports third-quarter 2026 results and gives its fourth-quarter outlook at its earnings conference on Thursday 15 October at 2 p.m. Taiwan time, against its own guidance of US$44.6-45.8 billion in revenue and a 65-67% gross margin.

The second fab on TSMC's north Phoenix campus, whose structure was finished in 2025, is due to begin high-volume manufacturing in the second half of 2027 - a year earlier than the schedule the company had previously given. Chairman C.C. Wei gave the pulled-forward date on 15 January 2026; the campus is the centrepiece of a $165 billion Arizona investment.

A16, TSMC's first node with Super Power Rail backside power delivery, is expected to reach volume production in 2027, a year after the 2026 production TSMC planned when it unveiled the node.

ESMC, TSMC's EUR 10 billion joint venture with Bosch, Infineon and NXP, is due to start production at its Dresden fab by the end of 2027 - Europe's first FinFET-capable foundry, making 28/22nm and 16/12nm chips mainly for cars and industry.

JASM's second fab in Kikuyo, Kumamoto - switched from 6nm-class chips to TSMC's 3nm process - is due to start volume production in 2028 at 15,000 12-inch wafers a month, making Japan's first 3nm chips about a year after the end-2027 start TSMC first promised.

The third fab on TSMC's north Phoenix campus, where ground was broken in April 2025, is slated for its 2nm (N2) and A16 processes and targeted for volume production by the end of the decade - the most advanced chipmaking TSMC has committed to the United States.