Épingles correspondant à tag:Semiconductors

Cannonlake Processors will be 15% faster than the Kaby Lake ones, 10nm FinFET Manufacturing Process, Chipset of 200 Series, USB 3.1 Gen 2 10Gbps support, 6 ports, Thermal Design Power (TDP) up to 95 W (LGA 1151), Updated Intel Optane Technology Support

The part, which would appear in a series of Radeon RX-600-branded graphics cards, will offer a 15 per cent performance boost compared to current RX-500 series cards, which were a minor refresh on 2016's RX-400s.

In December last year TSMC started to work on its 5nm process. In the following January we heard from the firm's CEO about the progress of these plans, with a target launch date set for H1 2020. Now a recent report suggests that TSMC is confident of reaching its previously publicised goals, as it has started to allocate between 300 and 400 R&D staff to work on developing its 3nm process.

Bosch opened its new 300mm wafer fab in Dresden, a roughly €1 billion, highly automated plant producing sensors and microchips for cars and consumer electronics.

The Commerce rule that took effect on 7 October 2022 put advanced computing chips, the tools to make them and the Americans who service them behind a licence. It is the sharpest single break in the technology relationship since 1979.

Prosecutors charged former TSMC engineer Chen Li-ming, by then at Tokyo Electron's Taiwan unit, and two serving TSMC engineers with stealing 2nm trade secrets, seeking 14, 9 and 7 years in Taiwan's first indictment for theft of a national core key technology.

At GTC Washington, Huang said Nvidia had shipped 6 million Blackwell GPUs over the previous four quarters, the baseline the later chip-sales projections build on.

TI began production at SM1, the first 300mm wafer fab on its site off US-75 at Shepherd Road in Sherman, three and a half years after breaking ground. The site is laid out for up to four connected fabs and is meant to support as many as 3,000 direct jobs; TI is spending more than $60 billion across seven fabs in Texas and Utah.

TSMC's first nanosheet-transistor node, N2, entered volume production in the fourth quarter of 2025 as planned, starting at Fab 22 in Kaohsiung, with Fab 20 in Hsinchu as its second 2nm fab.

Nvidia projected 20 million units of Blackwell and Rubin generation GPUs, against 4 million of the prior Hopper generation, alongside about $500 billion in combined sales.

A memorandum signed in Washington commits Taiwanese chipmakers such as TSMC to at least $250 billion of new US investment plus $250 billion in Taiwan credit guarantees, in return for a 15% tariff cap and Section 232 chip-tariff exemptions for companies building US fabs.

At GTC 2026, Huang said he expects purchase orders for Blackwell and Vera Rubin to reach $1 trillion through 2027, up from the $500 billion outlook given the previous year.

TSMC's largest annual customer event opened its 2026 series at the Santa Clara Convention Center on 22 April, where it debuted the A13 process, previewed A12 and introduced N2U.

Taiwan's Intellectual Property and Commercial Court jailed Chen Li-ming for 10 years, three TSMC engineers for 2 to 6 years, and fined Tokyo Electron's Taiwan unit NT$150 million - the first verdict under the National Security Act's core-technology clause.

TSMC reported second-quarter revenue of US$40.20 billion, up 33.7% from a year earlier, a 67.7% gross margin and record net income of NT$706.56 billion, guided Q3 revenue to US$44.6-45.8 billion and raised its 2026 capital budget to US$60-64 billion.

Nvidia said its Vera Rubin NVL72 rack systems are now shipping to cloud providers and system makers, with 288 GB of HBM4 per GPU and about five times Blackwell's inference performance.

AMD launched its Helios rack-scale AI system, built on MI455X GPUs and Venice EPYC CPUs, with shipments to Microsoft starting in the second half of 2026 and a 2 GW Anthropic deployment from 2027.

Taiwan's Supreme Court dismissed the appeals of Chen Li-ming and Chen Wei-chieh, making their 10- and 6-year sentences for leaking TSMC's 2nm and 14nm secrets final; both go straight to prison.

On its August earnings call Nvidia gave its first-ever year-ahead forecast: about 70% revenue growth in the fiscal year ending January 2028, roughly $673 billion, limited by supply rather than demand.

NVIDIA's revenue more than doubled from a year earlier to a record $96.2 billion for the quarter ended 26 July 2026, with Data Center at $89.0 billion, and it guided the third quarter to $108 billion.

Twenty-five months after its groundbreaking, ESMC - TSMC's joint venture with Bosch, Infineon and NXP - celebrated the topping-out of its roughly EUR 10 billion chip fab in Dresden, TSMC's first in Europe. The shell is finished; cleanroom fit-out follows, with the first process tools due in the second half of 2027.

In its first peer-reviewed benchmark, NVIDIA's Vera Rubin NVL72 rack posted up to 3.7x the throughput of GB300 NVL72 on Qwen3-VL and 2.5x on DeepSeek-R1, submitted in the preview category of MLCommons' MLPerf Inference v6.1 round.

Jensen Huang told reporters at a summit with King Charles III in Scotland that he expects Nvidia to sell twice as many chips next year as this year, citing AI demand in almost every country. Nvidia does not disclose total chip counts.

TSMC's 18th Open Innovation Platform Ecosystem Forum brings chip designers, EDA and IP partners and customers to the Santa Clara Convention Center on 23 September, opening a global series that ends in Israel in December.

TSMC reports third-quarter 2026 results and gives its fourth-quarter outlook at its earnings conference on Thursday 15 October at 2 p.m. Taiwan time, against its own guidance of US$44.6-45.8 billion in revenue and a 65-67% gross margin.

NVIDIA reports its third quarter of fiscal 2027 against its own guide of $108 billion in revenue, the quarter in which Vera Rubin is expected to reach about a fifth of Data Center sales.

Huang expects Nvidia to sell twice as many chips in 2027 as in 2026, the unit-growth projection behind the roughly 70% fiscal 2028 revenue guide.

Intel's Nova Lake desktop chips, branded Core Ultra 400, are reported to launch from Q1 2027 on the new LGA-1954 socket, with a 52-core flagship following later in 2027.

The second fab on TSMC's north Phoenix campus, whose structure was finished in 2025, is due to begin high-volume manufacturing in the second half of 2027 - a year earlier than the schedule the company had previously given. Chairman C.C. Wei gave the pulled-forward date on 15 January 2026; the campus is the centrepiece of a $165 billion Arizona investment.

A16, TSMC's first node with Super Power Rail backside power delivery, is expected to reach volume production in 2027, a year after the 2026 production TSMC planned when it unveiled the node.

ESMC, TSMC's EUR 10 billion joint venture with Bosch, Infineon and NXP, is due to start production at its Dresden fab by the end of 2027 - Europe's first FinFET-capable foundry, making 28/22nm and 16/12nm chips mainly for cars and industry.

JASM's second fab in Kikuyo, Kumamoto - switched from 6nm-class chips to TSMC's 3nm process - is due to start volume production in 2028 at 15,000 12-inch wafers a month, making Japan's first 3nm chips about a year after the end-2027 start TSMC first promised.

The third fab on TSMC's north Phoenix campus, where ground was broken in April 2025, is slated for its 2nm (N2) and A16 processes and targeted for volume production by the end of the decade - the most advanced chipmaking TSMC has committed to the United States.