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Qualcomm Discloses Exploited Graphics Flaw CVE-2026-21385
Qualcomm N, 5775, Morehouse Drive, Barnes Canyon, Sorrento Mesa, San Diego, San Diego County, California, 92121, United StatesQualcomm
確定確度 85%207 日前Android's[5] March 2026 bulletin is 'Published March 2, 2026' and says 'There are indications that CVE-2026-21385 may be under limited, targeted exploitation'; SecurityWeek[4] says Qualcomm[1] 'disclosed the security defect on Monday'.Qualcomm and Google disclosed a memory-corruption bug in an open-source Qualcomm graphics component, affecting more than 230 chipsets, that 'may be under limited, targeted exploitation'.0.76Qualcomm Unveils AI200 and AI250 Rack-Scale AI Inference Chips
確定確度 84%333 日前CNBC[4] reports 'Qualcomm[1][2][3] announced Monday' (Mon, Oct 27 2025, published 10:00 AM EDT) that it will release the AI200 and AI250; Qualcomm's release carries the same announcement.Qualcomm entered the data-center AI market with the AI200 and AI250 accelerator cards and liquid-cooled racks, with 768 GB of memory per card, due in 2026 and 2027; its stock jumped 11% that day.0.70- 0.69
Qualcomm's Dragonfly AI250 With High Bandwidth Compute Due in 2027
Qualcomm N, 5775, Morehouse Drive, Barnes Canyon, Sorrento Mesa, San Diego, San Diego County, California, 92121, United States
推定確度 66%1.3 年後The October 2025 launch release says AI250 is 'expected to be commercially available in ... 2027', and the June 2026 roadmap expects 'Commercial sampling of HBC Gen 1 with AI250 ... in mid-2027'; a bare year is dated to 31 December.[1]Qualcomm's second-generation data-center AI accelerator, the Dragonfly AI250, is due in 2027 with High Bandwidth Compute near-memory stacking that gives 133 TB/s of effective bandwidth per card, 18 times the AI200.0.69- 0.68
Qualcomm Launches Dragonfly Data Center Line: C1000 CPU and AI300 at Investor Day
確定確度 84%93 日前The release, dated Jun 24, 2026 and datelined NEW YORK, says Qualcomm[1][2][3] 'today announced at its Investor Day' the new data center solutions; Qualcomm's page stamps it 19:30 UTC.At its 2026 Investor Day in New York, Qualcomm branded its data-center products Dragonfly and unveiled the 250-plus-core Dragonfly C1000 CPU, the AI300 accelerator and High Bandwidth Compute memory, with Meta signed up for the CPU; the stock jumped 15%.0.68Qualcomm Launches the Snapdragon X2 Plus at CES 2026
確定確度 87%263 日前The release is datelined 'Jan 5, 2026 | LAS VEGAS' ('At CES, Qualcomm[1][2][3] Technologies, Inc. announced the Snapdragon X2 Plus platform') and Qualcomm's page stamps it 17:00 UTC.At CES 2026 Qualcomm added the Snapdragon X2 Plus to its PC line, a 3 nm chip with up to 10 Oryon cores and an 80 TOPS NPU that brings X2-series performance and multi-day battery life to lower-priced Copilot+ laptops from the first half of 2026.0.67Qualcomm Unveils the 5 GHz Snapdragon X2 Elite Extreme and X2 Elite PC Chips
確定確度 85%昨年The release is datelined MAUI and Qualcomm's[1][2][3][4] page stamps it 24 Sep 2025 20:30 UTC, the 10:30 AM HT Product Announcements Keynote at Snapdragon Summit 2025.Qualcomm unveiled the Snapdragon X2 Elite Extreme and X2 Elite, 3 nm Windows PC processors with up to 18 Oryon cores, the first Arm-compatible CPU to reach 5 GHz and an 80 TOPS NPU, for laptops in the first half of 2026.0.66Qualcomm Acquires RISC-V CPU Designer Ventana Micro Systems
確定確度 86%289 日前Qualcomm's[1] release dated 10 December 2025 'today announced the acquisition of Ventana Micro Systems Inc.'; The Register[3] reported it on Wednesday 10 December 2025.Qualcomm bought Ventana Micro Systems, the Cupertino designer of high-performance RISC-V server CPU chiplets, to build RISC-V CPUs alongside its custom Arm-based Oryon cores.0.66Qualcomm Unveils the X105, the First 3GPP Release 19-Ready 5G Modem
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確定確度 89%207 日前The release is datelined 'Mar 2, 2026 | BARCELONA' and Qualcomm's[1][2] page stamps it 07:00 UTC; it invites 'Attendees of MWC Barcelona' to booth 3E10.At MWC Barcelona 2026 Qualcomm unveiled the X105 5G Modem-RF, the first modem ready for 3GPP Release 19, with 14.8 Gbps peak downloads, video calls over satellite and the first 6 nm RF transceiver, for devices in the second half of 2026.0.66- 0.65
Qualcomm Introduces Snapdragon C for Entry-Level Laptops
確定確度 86%120 日前The release is datelined 'May 28, 2026 | SAN DIEGO' and Qualcomm's[1][2] page stamps it 13:00 UTC.Qualcomm launched Snapdragon C, an entry-tier laptop processor with an integrated NPU for machines from about $300, with designs from Acer, HP and Lenovo aimed at students, families and small businesses.0.65
