Cannonlake Processors will be 15% faster than the Kaby Lake ones,
10nm FinFET Manufacturing Process,
Chipset of 200 Series,
USB 3.1 Gen 2 10Gbps support, 6 ports,
Thermal Design Power (TDP) up to 95 W (LGA 1151),
Updated Intel Optane Technology Support
Intel's first 10nm Cannon Lake chip, the dual-core Core i3-8121U (2.2GHz base, 3.2GHz Turbo, 4MB cache, 15W TDP), appeared in the Lenovo IdeaPad 330 in May 2018, and Intel's Ark listed it as launched in Q2 2018[3]
In April 2018 Intel said it would focus on 14nm shipments that year, with high-volume 10nm manufacturing moved into 2019 to improve yield[3]
Notable features
Cannon Lake is Intel's codename for Core processors built on Palm Cove, a 10 nm die shrink of the Kaby Lake microarchitecture, and the first mainstream CPUs to support the AVX-512 instruction set[2]
Its only production model, the Core i3-8121U, is a dual-core laptop chip with Hyper-Threading and Turbo Boost; its integrated GPU is physically on the die but was disabled during factory binning, and it shipped in very limited quantities[2]
It supports DDR4-2400 and LPDDR4/x-2400 up to 32GB, and Ark lists no integrated GPU, suggesting a discrete GPU is needed[3]
Palm Cove cores carry 64 KB of L1 and 256 KB of L2 cache per core, with 2 MB of L3 per core, in a BGA 1440 package[2]
The first entry is always the pin's source. Overall confidence is a weighted average of how firmly each reference supports the start and end times used above; a reference counts half as much for every 180 days older than the newest.
en.wikipedia.org· Added Sep 22, 2026· 100% of score
Wikipedia's Cannon Lake article says it is "based on Palm Cove, a 10 nm die shrink of the Kaby Lake microarchitecture", the "first mainstream CPUs to support the AVX-512 instruction set", and that the sole model, the Core i3-8121U, has its integrated GPU disabled.
appleinsider.com· Published May 17, 2018· 0% of score
AppleInsider reports Intel's first 10nm Cannon Lake chip, the Core i3-8121U, "launched in the second quarter of 2018" and had shipped by the article's May 17, 2018 publish date - postdating the pin's stored April 1, 2018 date by roughly six weeks.
techpowerup.com· Published May 16, 2018· 0% of score
TechPowerUp's own title and May 16, 2018 publish date - "Intel Core i3-8121U Cannon Lake Processor Debuts in Lenovo Ideapad 330 Laptop" - corroborate AppleInsider's[3] near-identical May 2018 timing, both later than the pin's stored April 1, 2018 date, though the page itself could not be fetched directly.
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CONFIRMED82% CONFIDENCE1 day agoAvailability date from Apple's[1][2][3] own newsroom announcement (https://www.apple.com/newsroom/2026/08/apple-unveils-a-more-powerful-mac-mini-featuring-the-all-new-m6-and-m5-pro/): pre-orders from August 25, 2026, and it 'will begin arriving to customers, and in Apple Store locations and Apple Authorized Resellers, starting September 22'. September 22, 2026 is the shipping/on-sale day.
Compact desktop with new Apple silicon promising up to 4x faster AI performance.
CONFIRMED78% CONFIDENCE9.1 years agoHappened as dated, per macrumors.com[1]: "…ps in August Intel plans to move up the launch of its 14-nanometer Coffee Lake processors, introduci…"
Intel plans to move up the launch of its 14-nanometer Coffee Lake processors, introducing them in August of 2017 instead of January 2018. According to DigiTimes, the launch is being moved up because of "increasing competition from AMD's Ryzen 7 and Ryzen 5 processors."
CONFIRMED90% CONFIDENCE9.2 years agoHappened as dated, per hexus.net[1]: "Intel[2] Movidius Neural Compute Stick available for US$79 Tags: Intel (NASDAQ:INTC) Quick Link: HE…"
Offers more than 100 GFLOPS of inference performance within a 1W power envelope.
ESTIMATED67% CONFIDENCEin 189 daysA leaked roadmap puts the first Nova Lake CPUs in Q1 2027 (28-core between January and March); Intel has only said before the end of 2026 or early 2027.[1]
Intel's Nova Lake desktop chips, branded Core Ultra 400, are reported to launch from Q1 2027 on the new LGA-1954 socket, with a 52-core flagship following later in 2027.
CONFIRMED79% CONFIDENCE8.5 years agoHappened as dated, per hexus.net[1]: "…xf Add to My Vault: GLOBALFOUNDRIES has announced that it plans to power straight through to 7nm Fin…"
Tech expected to be ready for chip designers in H2 2017, production in early 2018. It will skip "the marginal performance and power benefits for the high cost of the 10nm process node" to hopefully become a leading differentiated 7nm chip fabricator ahead of major rivals.
CONFIRMED78% CONFIDENCE9.3 years agoHappened as dated, per macrumors.com[1][5]: "…ured Using TSMC's 10nm Process With the launch of the new iPad Pro models at WWDC this year, Apple i…"
With the launch of the new iPad Pro models at WWDC this year, Apple introduced new 10.5-inch and 12.9-inch devices that both came with an A10X Fusion Chip, which is said to deliver 30 percent faster CPU performance than previous-generation iPad Pro models and 40 percent faster graphics performance. In comparison, the A9 and A10 were built using a 16-nanometer process, the A8 used a 20-nanometer process, and the A7 used a 28-nanometer process.
AMD launched its Helios rack-scale AI system, built on MI455X GPUs and Venice EPYC CPUs, with shipments to Microsoft starting in the second half of 2026 and a 2 GW Anthropic deployment from 2027.
CONFIRMED77% CONFIDENCE8.5 years agoHappened as dated, per macrumors.com[1]: "…nes that use the new technology will be released in the first quarter of 2018. Get weekly top MacRum…"
Intel and AMD are joining forces to produce new 8th-Generation H-Series Intel mobile processors paired with stacked second-generation High Bandwidth Memory and custom-built discrete graphics from AMD. For the new H-Series chips, which feature all of the above listed components in a single processor package, Intel says is using its Embedded Multi-Die Interconnect Bridge (EMIB), a power-sharing framework that reduces the standard silicon footprint to less than half that of standard discrete components on a motherboard. This is the first consumer product that takes advantage of EMIB.
CONFIRMED82% CONFIDENCE26 days agoStereoNET[2] (https://www.stereonet.com/news/mcintosh-cs7500-preamp-streams-its-way-in-as-your-high-end-hi-fi-hub) reports the CS7500 as 'available from 28th August' 2026, two days after McIntosh's 26 August announcement. That stated on-sale day is used as the pin date.
High-end streaming preamplifier combining an 8-channel 32-bit DAC with versatile connectivity.
CONFIRMED78% CONFIDENCE12.1 years agoHappened as dated, per the pin description: "Report: Haswell-E, X99, DDR4 to Arrive August 29. Expect three CPUs to arrive: The Core i7-5…"
Expect three CPUs to arrive: The Core i7-5820K, the Core i7-5930K, and the Core i7-5960X. Rumored specifications are in the table.
CONFIRMED78% CONFIDENCE12.7 years agoHappened as dated, per hexus.net[1]: "AMD reveals further details and release date for Kaveri APU Tags: AMD (NYSE:AMD) Quick Link:…"
AMD boasted performance figure of 856 GFLOPS from the new processor, which utilises a heterogeneous system architecture, where compute and graphics cores share the same system memory.
Fairchild Semiconductor Corporation site, East Charleston Road, Palo Alto, Santa Clara County, California, 94043, United StatesFairchild Semiconductor
CONFIRMED88% CONFIDENCE61.4 years agoThe IEEE reprint carries the original citation on its own first page: "Reprinted from Gordon E. Moore, 'Cramming More Components onto Integrated Circuits,' Electronics, pp. 114-117, April 19, 1965."[1]
Gordon Moore's four-page article in Electronics observes that the number of components per chip has been doubling yearly and projects it forward a decade. The observation becomes Moore's law and the semiconductor industry's roadmap.
