CONFIRMED77% CONFIDENCEHappened as dated, per macrumors.com[1]: "…nes that use the new technology will be released in the first quarter of 2018. Get weekly top MacRum…"
Intel and AMD are joining forces to produce new 8th-Generation H-Series Intel mobile processors paired with stacked second-generation High Bandwidth Memory and custom-built discrete graphics from AMD. For the new H-Series chips, which feature all of the above listed components in a single processor package, Intel says is using its Embedded Multi-Die Interconnect Bridge (EMIB), a power-sharing framework that reduces the standard silicon footprint to less than half that of standard discrete components on a motherboard. This is the first consumer product that takes advantage of EMIB.
On 6 November 2017 Intel and AMD announced 8th-generation H-series Intel mobile processors paired with a semi-custom AMD Radeon GPU and stacked second-generation HBM2 in a single package[1][4]
The aim is thin, light laptops that can game, helping compete with Nvidia; AMD's Scott Herkelman said it expands the installed base for Radeon GPUs[1][4]
Intel expected the product to launch in the first quarter of 2018[1][4]
At CES 2018 HP's 15-inch Spectre x360 offered the new Kaby Lake-G chip with Radeon RX Vega M graphics, from $1,369.99 on 18 March[3]
Notable features
The package uses Intel's Embedded Multi-Die Interconnect Bridge (EMIB), cutting the silicon footprint to less than half that of standard discrete components, and is the first consumer product to use EMIB[1]
Intel developed drivers to coordinate temperature and power sharing across the package[1]
Released in Q1 2018 as Kaby Lake G, the line (Core i7-8809G, 8709G, 8706G, 8705G and Core i5-8305G) pairs Intel HD 630 integrated graphics with a Radeon RX Vega M GH (100 W package) or GL (65 W) discrete chip; the top i7-8809G has four cores and eight threads at 3.1 GHz base, 4.2 GHz turbo, with 8 MB of L3 cache[2]
The Radeon GPU links to the CPU over an on-package PCI Express connection and to its HBM2 through EMIB; the Vega M GH has 24 compute units (1,536 shaders) at up to 1,190 MHz and the GL 20 (1,280) at up to 1,011 MHz, with 4 GB of HBM2 on a 1,024-bit bus at 204.8 and 179.2 GB/s[2]
The first entry is always the pin's source. Overall confidence is a weighted average of how firmly each reference supports the start and end times used above; a reference counts half as much for every 180 days older than the newest.
en.wikipedia.org· Added Sep 22, 2026· 100% of score
Wikipedia's Kaby Lake article lists the 8th-generation Kaby Lake G processors (release Q1 2018; i7-8809G 4 cores/8 threads, 3.1/4.2 GHz, 8 MB L3, 100 W with Radeon RX Vega M GH) and the Vega M GH/GL GPU specs with 4 GB HBM2 at 204.8/179.2 GB/s, linked via EMIB.
LaptopMag covers a related but distinct product, the HP Spectre x360, confirming "the newly announced Intel Kaby Lake-G chip with built-in Radeon RX Vega M graphics" would ship around 18 March 2018 - tangential corroboration of the Intel-AMD[4] chip's Q1 2018 arrival rather than the pin's own November 2017 announcement.
AMD's own investor-relations release, dated 6 November 2017, confirms the semi-custom GPU partnership itself, describing "an Intel Core processor, semi-custom Radeon graphics chip, and second generation High Bandwidth Memory (HBM2) into a single package," the original announcement the pin's stored Q1 2018 date follows.
Suggest a correction
Something missing or wrong? Say it in your own words: a link that backs this pin up, a different start or end date and why, or a fact it lacks or gets wrong. The AI checks it against this pin's sources, searches for better ones, and adds any page that backs you up. The pin's own sources still count most.
CONFIRMED78% CONFIDENCE12.7 years agoHappened as dated, per hexus.net[1]: "AMD reveals further details and release date for Kaveri APU Tags: AMD (NYSE:AMD) Quick Link:…"
AMD boasted performance figure of 856 GFLOPS from the new processor, which utilises a heterogeneous system architecture, where compute and graphics cores share the same system memory.
AMD launched its Helios rack-scale AI system, built on MI455X GPUs and Venice EPYC CPUs, with shipments to Microsoft starting in the second half of 2026 and a 2 GW Anthropic deployment from 2027.
CONFIRMED78% CONFIDENCE9.1 years agoHappened as dated, per macrumors.com[1]: "…ps in August Intel plans to move up the launch of its 14-nanometer Coffee Lake processors, introduci…"
Intel plans to move up the launch of its 14-nanometer Coffee Lake processors, introducing them in August of 2017 instead of January 2018. According to DigiTimes, the launch is being moved up because of "increasing competition from AMD's Ryzen 7 and Ryzen 5 processors."
CONFIRMED89% CONFIDENCE12.0 years agoHappened as dated, per macrumors.com[1]: "Intel Preparing to Launch New Xeon Processors for Potential Mac Pro Upgrade Aft…"
Potential Mac Pro customers may now, be starting to look forward to the first update for the redesigned Mac Pro, as Intel appears set to launch new processors appropriate for the Mac Pro next month. Intel's "Grantley" Xeon E5 v3 chips are nearly ready to ship as successors to the current "Romley" Xeon E5 v2 chips used in the Mac Pro.
CONFIRMED92% CONFIDENCE12.9 years agoHappened as dated, per hexus.net[1]: "…y surprising given AMD's Radeon R9 290X launch last week and serving as a tacit understanding that i…"
ESTIMATED67% CONFIDENCEin 189 daysA leaked roadmap puts the first Nova Lake CPUs in Q1 2027 (28-core between January and March); Intel has only said before the end of 2026 or early 2027.[1]
Intel's Nova Lake desktop chips, branded Core Ultra 400, are reported to launch from Q1 2027 on the new LGA-1954 socket, with a 52-core flagship following later in 2027.
CONFIRMED90% CONFIDENCE9.2 years agoHappened as dated, per hexus.net[1]: "Intel[2] Movidius Neural Compute Stick available for US$79 Tags: Intel (NASDAQ:INTC) Quick Link: HE…"
Offers more than 100 GFLOPS of inference performance within a 1W power envelope.
CONFIRMED75% CONFIDENCE6.3 years agoHappened as dated, per hexus.net[1]: "…llular modem product news, the XMM 7660 was announced. This is an LTE modem that delivers Cat-19 cap…"
5G promises greater speed, higher capacity, and low latency to our essential high-tech smart connected devices. Intel wants to make the transition to 5G smooth and seamless and with this in mind has designed a powerful end-to-end 5G solution. The Intel XMM 8000 series is Intel's first family of commercial 5G multi-mode modems, operating in both sub-6GHz and millimetre wave global spectrum bands. Intel hopes to gather a mass of design wins for the XMM 8000 in PC, phones, and even vehicles.
CONFIRMED78% CONFIDENCE12.1 years agoHappened as dated, per the pin description: "Report: Haswell-E, X99, DDR4 to Arrive August 29. Expect three CPUs to arrive: The Core i7-5…"
Expect three CPUs to arrive: The Core i7-5820K, the Core i7-5930K, and the Core i7-5960X. Rumored specifications are in the table.
CONFIRMED90% CONFIDENCE330 days agoCNBC's[1] 28 October 2025 GTC Washington coverage reports the remark.
At GTC Washington, Huang said Nvidia had shipped 6 million Blackwell GPUs over the previous four quarters, the baseline the later chip-sales projections build on.
CONFIRMED82% CONFIDENCE1 day agoAvailability date from Apple's[1][2][3] own newsroom announcement (https://www.apple.com/newsroom/2026/08/apple-unveils-a-more-powerful-mac-mini-featuring-the-all-new-m6-and-m5-pro/): pre-orders from August 25, 2026, and it 'will begin arriving to customers, and in Apple Store locations and Apple Authorized Resellers, starting September 22'. September 22, 2026 is the shipping/on-sale day.
Compact desktop with new Apple silicon promising up to 4x faster AI performance.
