通信2018/02/27@ThePinGang
5Gの大規模展開
Intel
開始 2020/06/15 確定確度 75%6.3 年前hexus.net^[1]によると日付どおりに実施された：「…携帯モデム製品のニュースでは、XMM 7660が発表された。これはCat-19の性能を実現するLTEモデムで…」
5Gは、欠かせない存在となったハイテクのスマートな接続デバイスに、より高速・大容量・低遅延の通信をもたらす。インテルは5Gへの移行を円滑にすることを目指し、強力なエンドツーエンドの5Gソリューションを設計した。Intel XMM 8000シリーズは同社初の商用5Gマルチモードモデムファミリーで、世界のサブ6GHz帯とミリ波帯の両方で動作する。インテルは、PCやスマートフォン、さらには自動車でXMM 8000の採用を大量に獲得したい考えである。
0.77
半導体2026/09/25@TechDesk
Qualcomm Launches the 2 nm Snapdragon 8 Elite Extreme Gen 6 and 8 Elite Gen 6
QualcommMaui County, Hawaii, United States
開始 2026/09/22 20:00確定確度 86%3 日前The release is dated 'Sep 22, 2026 | MAUI' ('unveiled today') and Qualcomm's^[1][2][3][4] page stamps it 20:00 UTC, the 10:00 AM HT mobile keynote at Snapdragon Summit.
Qualcomm unveiled two flagship phone chips at Snapdragon Summit 2026 - the Snapdragon 8 Elite Extreme Gen 6 and 8 Elite Gen 6 - on a 2 nm process with 5 GHz Oryon cores, the X105 modem and Wi-Fi 8, for phones from Xiaomi, OnePlus, OPPO, vivo, Honor and Motorola.
0.73
半導体2026/09/25@TechDesk
Qualcomm Launches the Snapdragon X2 Plus at CES 2026
QualcommLas Vegas Convention Center West Hall Expansion, Vegas Loop, Las Vegas Convention Center, Filipino Town, Winchester, Clark County, Nevada, 89109, United States
開始 2026/01/05 17:00確定確度 87%263 日前The release is datelined 'Jan 5, 2026 | LAS VEGAS' ('At CES, Qualcomm^[1][2][3] Technologies, Inc. announced the Snapdragon X2 Plus platform') and Qualcomm's page stamps it 17:00 UTC.
At CES 2026 Qualcomm added the Snapdragon X2 Plus to its PC line, a 3 nm chip with up to 10 Oryon cores and an 80 TOPS NPU that brings X2-series performance and multi-day battery life to lower-priced Copilot+ laptops from the first half of 2026.
0.73
半導体2026/09/25@TechDesk
Qualcomm Unveils the 5 GHz Snapdragon X2 Elite Extreme and X2 Elite PC Chips
QualcommHyatt Regency Maui Resort and Spa, 200, Nohea Kai Drive, Lahaina, Maui County, Hawaii, 96761, United States
開始 2025/09/24 20:30確定確度 85%昨年The release is datelined MAUI and Qualcomm's^[1][2][3][4] page stamps it 24 Sep 2025 20:30 UTC, the 10:30 AM HT Product Announcements Keynote at Snapdragon Summit 2025.
Qualcomm unveiled the Snapdragon X2 Elite Extreme and X2 Elite, 3 nm Windows PC processors with up to 18 Oryon cores, the first Arm-compatible CPU to reach 5 GHz and an 80 TOPS NPU, for laptops in the first half of 2026.
0.73
半導体2017/06/15@ThePinGang
クアルコム、マルチギガビットのストリーミング向けトライバンドWi-Fiチップを投入へ
Qualcomm
2015/03/02〜2015/03/15 確定確度 76%11.6 年前arstechnica.com^[1]によれば、日付どおりに行われた：「…Gig』。Snapdragon 810は2015年上半期に出荷される見通しだ。クアルコムは財…を開示しなかった…」
クアルコムはWilocityの買収を完了したと発表し、まもなく「Qualcomm Atheros, Inc.のWi-FiとWiGigのソリューションを組み合わせ、性能を大幅に高め、最先端のワイヤレスアプリケーションを可能にするトライバンドプラットフォーム群を提供する。最初のトライバンドプラットフォームは、WiGigに対応するよう設計された世界初のモバイルプラットフォームであるQualcomm Snapdragon 810をベースとしたリファレンスデザインだ」とした。Snapdragon 810は2015年上半期に出荷される見通しだ。
0.73
半導体2026/09/25@TechDesk
Qualcomm Launches the Snapdragon 8 Elite Gen 5 at Snapdragon Summit
QualcommHyatt Regency Maui Resort and Spa, 200, Nohea Kai Drive, Lahaina, Maui County, Hawaii, 96761, United States
開始 2025/09/24 20:30確定確度 86%昨年The release is datelined MAUI and Qualcomm's^[1][2][3][4] page stamps it 24 Sep 2025 20:30 UTC, the 10:30 AM HT start of the summit's Product Announcements Keynote.
Qualcomm unveiled the Snapdragon 8 Elite Gen 5, a 3 nm phone chip with a 4.74 GHz third-generation Oryon CPU that it called the world's fastest mobile system-on-a-chip, for flagships from Samsung, Xiaomi, OnePlus and a dozen other brands.
0.72
半導体2026/09/25@TechDesk
Qualcomm's Dragonfly AI250 With High Bandwidth Compute Due in 2027
Qualcomm N, 5775, Morehouse Drive, Barnes Canyon, Sorrento Mesa, San Diego, San Diego County, California, 92121, United StatesQualcomm
開始 2027/12/31推定確度 66%1.3 年後The October 2025 launch release says AI250 is 'expected to be commercially available in ... 2027', and the June 2026 roadmap expects 'Commercial sampling of HBC Gen 1 with AI250 ... in mid-2027'; a bare year is dated to 31 December.^[1]
Qualcomm's second-generation data-center AI accelerator, the Dragonfly AI250, is due in 2027 with High Bandwidth Compute near-memory stacking that gives 133 TB/s of effective bandwidth per card, 18 times the AI200.
0.70
半導体2026/09/25@TechDesk
Qualcomm Introduces Snapdragon C for Entry-Level Laptops
QualcommQualcomm N, 5775, Morehouse Drive, Barnes Canyon, Sorrento Mesa, San Diego, San Diego County, California, 92121, United States
開始 2026/05/28 13:00確定確度 86%120 日前The release is datelined 'May 28, 2026 | SAN DIEGO' and Qualcomm's^[1][2] page stamps it 13:00 UTC.
Qualcomm launched Snapdragon C, an entry-tier laptop processor with an integrated NPU for machines from about $300, with designs from Acer, HP and Lenovo aimed at students, families and small businesses.
0.69
カンファレンス2026/09/25@TechDesk
Snapdragon Summit 2025 in Maui
QualcommHyatt Regency Maui Resort and Spa, 200, Nohea Kai Drive, Lahaina, Maui County, Hawaii, 96761, United States
開始 2025/09/24 0:30確定確度 84%昨年Qualcomm's^[1][4][5] event page, archived during the event, says 'Snapdragon Summit is September 23 – 25, 2025 in Maui, Hawaii' and opens Day 1 (Tuesday, Sept 23) at '2:30 PM HT'; the recap itself gives no dates.
Qualcomm's tenth Snapdragon Summit ran three days in Maui, where it launched the Snapdragon 8 Elite Gen 5 phone chip and the 5 GHz Snapdragon X2 Elite Extreme and X2 Elite PC processors, with Google's Rick Osterloh, Adobe's Shantanu Narayen and HUMAIN's Tareq Amin on stage.
0.69
半導体2026/09/25@TechDesk
Qualcomm Unveils Snapdragon Reality Elite XR Chip at AWE 2026
Long Beach Convention Center, 300, East Ocean Boulevard, Long Beach, Los Angeles County, California, 90802, United StatesQualcomm
開始 2026/06/16 17:00確定確度 85%101 日前The release is dated Jun 16, 2026 ('Qualcomm^[1][2][3][4] Technologies Inc. today announced at Augmented World Expo the Snapdragon Reality Elite Platform') and Qualcomm's page stamps it 17:00 UTC.
At Augmented World Expo 2026 in Long Beach, Qualcomm launched Snapdragon Reality Elite, an XR platform with 48 TOPS of on-device AI and 4.4K-per-eye graphics that will power XREAL's Project Aura Android XR glasses.
0.68
カンファレンス2026/09/25@TechDesk
Cristiano Amon Opens COMPUTEX 2025 With Qualcomm's Keynote in Taipei
QualcommNangang Exhibition Center No2, 2, Jingmao 2nd Road, Sanzhong Village, Nangang District, Sanchongpu, Taipei, 115, Taiwan
開始 2025/05/19 6:00確定確度 88%1.3 年前COMPUTEX's organiser says 'The keynote will be on 14:00, May 19, (UTC+8), at Taipei Nangang Exhibition Center Hall 2, 7F', and Qualcomm's^[2][3] release lists 'May 19 from 2-3 p.m. Taiwan time'.
Qualcomm's CEO took the COMPUTEX 2025 keynote stage in Taipei a year after Snapdragon X entered the PC market, citing 85+ Snapdragon X PCs launched or in development and joined by Microsoft, ASUS, HP and Lenovo executives.
0.68
半導体2026/09/25@TechDesk
Qualcomm Launches Dragonfly Data Center Line: C1000 CPU and AI300 at Investor Day
QualcommManhattan, New York County, New York, United States
開始 2026/06/24 19:30確定確度 84%93 日前The release, dated Jun 24, 2026 and datelined NEW YORK, says Qualcomm^[1][2][3] 'today announced at its Investor Day' the new data center solutions; Qualcomm's page stamps it 19:30 UTC.
At its 2026 Investor Day in New York, Qualcomm branded its data-center products Dragonfly and unveiled the 250-plus-core Dragonfly C1000 CPU, the AI300 accelerator and High Bandwidth Compute memory, with Meta signed up for the CPU; the stock jumped 15%.
0.68

The release is datelined 'Mar 2, 2026 | BARCELONA' and Qualcomm's^[1][2] page stamps it 07:00 UTC; it invites 'Attendees of MWC Barcelona' to booth 3E10.

開始: 2026年3月2日確度 90%出典：出典

Qualcomm Unveils the X105, the First 3GPP Release 19-Ready 5G Modem

At MWC Barcelona 2026 Qualcomm unveiled the X105 5G Modem-RF, the first modem ready for 3GPP Release 19, with 14.8 Gbps peak downloads, video calls over satellite and the first 6 nm RF transceiver, for devices in the second half of 2026.

Qualcomm announced the X105 5G Modem-RF at MWC Barcelona 2026 as the industry's first 3GPP Release 19-ready modem, laying groundwork for 6G development and testing^[1][2]
Its fifth-generation AI processor uses agentic AI inside the modem to classify and optimise traffic for gaming, calls and social media^[1]
Operators backing it included China Telecom, China Mobile, China Unicom, Deutsche Telekom, KDDI, Telstra, T-Mobile and NTT DOCOMO^[1]
It was sampling to customers, with commercial devices expected in the second half of 2026^[1]

Notable features

Peak 14.8 Gbps download (13.2 Gbps on sub-6 GHz) and 4.2 Gbps upload^[1][2]
First 6 nm RF transceiver: up to 30% lower power and 15% smaller board footprint than the previous generation^[1]
Integrated NR-NTN for video calls, streaming, data, voice and messaging over satellite^[1]
First quad-frequency (L1, L2, L5, L6) GNSS engine^[1]
500 MHz of aggregated bandwidth^[2]

@TechDesk

参考資料 2確度 89%

最初の項目は常にピンの出典です。全体の確度は、各資料が上記の開始・終了時刻をどれだけ強く裏付けているかの加重平均です。最新の資料より180日古くなるごとに、重みは半分になります。

[1]90%
qualcomm.com/news/releases/2026/03/qualcomm-announces-5g-advanced-leap-with-qualcomm-x105-5g-modem-
qualcomm.com· 投稿 2026年9月25日· 開始 2026年3月2日 ✓· スコアの 50%
The release is datelined 'Mar 2, 2026 | BARCELONA' and Qualcomm's^[2] page stamps it 07:00 UTC; it invites 'Attendees of MWC Barcelona' to booth 3E10.
[2]88%
Qualcomm X105 5G Modem-RF product page (Qualcomm)
qualcomm.com· 追加 2026年9月25日· スコアの 50%
Product page: first 3GPP Release 19-ready modem-RF, 5th-generation 5G AI Processor, NR-NTN satellite, quad-frequency GNSS, first 6 nm RF transceiver cutting power 30%, 500 MHz aggregated bandwidth, 14.8 Gbps down and 4.2 Gbps up.^[1]

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1Qualcomm Unveils the X105, the First 3GPP Release 19-Ready 5G Modem開始時 $141.03

通信2018/02/27@ThePinGang
5Gの大規模展開
Intel
開始 2020/06/15 確定確度 75%6.3 年前hexus.net^[1]によると日付どおりに実施された：「…携帯モデム製品のニュースでは、XMM 7660が発表された。これはCat-19の性能を実現するLTEモデムで…」
5Gは、欠かせない存在となったハイテクのスマートな接続デバイスに、より高速・大容量・低遅延の通信をもたらす。インテルは5Gへの移行を円滑にすることを目指し、強力なエンドツーエンドの5Gソリューションを設計した。Intel XMM 8000シリーズは同社初の商用5Gマルチモードモデムファミリーで、世界のサブ6GHz帯とミリ波帯の両方で動作する。インテルは、PCやスマートフォン、さらには自動車でXMM 8000の採用を大量に獲得したい考えである。
0.77
半導体2026/09/25@TechDesk
Qualcomm Launches the 2 nm Snapdragon 8 Elite Extreme Gen 6 and 8 Elite Gen 6
QualcommMaui County, Hawaii, United States
開始 2026/09/22 20:00確定確度 86%3 日前The release is dated 'Sep 22, 2026 | MAUI' ('unveiled today') and Qualcomm's^[1][2][3][4] page stamps it 20:00 UTC, the 10:00 AM HT mobile keynote at Snapdragon Summit.
Qualcomm unveiled two flagship phone chips at Snapdragon Summit 2026 - the Snapdragon 8 Elite Extreme Gen 6 and 8 Elite Gen 6 - on a 2 nm process with 5 GHz Oryon cores, the X105 modem and Wi-Fi 8, for phones from Xiaomi, OnePlus, OPPO, vivo, Honor and Motorola.
0.73
半導体2026/09/25@TechDesk
Qualcomm Launches the Snapdragon X2 Plus at CES 2026
QualcommLas Vegas Convention Center West Hall Expansion, Vegas Loop, Las Vegas Convention Center, Filipino Town, Winchester, Clark County, Nevada, 89109, United States
開始 2026/01/05 17:00確定確度 87%263 日前The release is datelined 'Jan 5, 2026 | LAS VEGAS' ('At CES, Qualcomm^[1][2][3] Technologies, Inc. announced the Snapdragon X2 Plus platform') and Qualcomm's page stamps it 17:00 UTC.
At CES 2026 Qualcomm added the Snapdragon X2 Plus to its PC line, a 3 nm chip with up to 10 Oryon cores and an 80 TOPS NPU that brings X2-series performance and multi-day battery life to lower-priced Copilot+ laptops from the first half of 2026.
0.73
半導体2026/09/25@TechDesk
Qualcomm Unveils the 5 GHz Snapdragon X2 Elite Extreme and X2 Elite PC Chips
QualcommHyatt Regency Maui Resort and Spa, 200, Nohea Kai Drive, Lahaina, Maui County, Hawaii, 96761, United States
開始 2025/09/24 20:30確定確度 85%昨年The release is datelined MAUI and Qualcomm's^[1][2][3][4] page stamps it 24 Sep 2025 20:30 UTC, the 10:30 AM HT Product Announcements Keynote at Snapdragon Summit 2025.
Qualcomm unveiled the Snapdragon X2 Elite Extreme and X2 Elite, 3 nm Windows PC processors with up to 18 Oryon cores, the first Arm-compatible CPU to reach 5 GHz and an 80 TOPS NPU, for laptops in the first half of 2026.
0.73
半導体2017/06/15@ThePinGang
クアルコム、マルチギガビットのストリーミング向けトライバンドWi-Fiチップを投入へ
Qualcomm
2015/03/02〜2015/03/15 確定確度 76%11.6 年前arstechnica.com^[1]によれば、日付どおりに行われた：「…Gig』。Snapdragon 810は2015年上半期に出荷される見通しだ。クアルコムは財…を開示しなかった…」
クアルコムはWilocityの買収を完了したと発表し、まもなく「Qualcomm Atheros, Inc.のWi-FiとWiGigのソリューションを組み合わせ、性能を大幅に高め、最先端のワイヤレスアプリケーションを可能にするトライバンドプラットフォーム群を提供する。最初のトライバンドプラットフォームは、WiGigに対応するよう設計された世界初のモバイルプラットフォームであるQualcomm Snapdragon 810をベースとしたリファレンスデザインだ」とした。Snapdragon 810は2015年上半期に出荷される見通しだ。
0.73
半導体2026/09/25@TechDesk
Qualcomm Launches the Snapdragon 8 Elite Gen 5 at Snapdragon Summit
QualcommHyatt Regency Maui Resort and Spa, 200, Nohea Kai Drive, Lahaina, Maui County, Hawaii, 96761, United States
開始 2025/09/24 20:30確定確度 86%昨年The release is datelined MAUI and Qualcomm's^[1][2][3][4] page stamps it 24 Sep 2025 20:30 UTC, the 10:30 AM HT start of the summit's Product Announcements Keynote.
Qualcomm unveiled the Snapdragon 8 Elite Gen 5, a 3 nm phone chip with a 4.74 GHz third-generation Oryon CPU that it called the world's fastest mobile system-on-a-chip, for flagships from Samsung, Xiaomi, OnePlus and a dozen other brands.
0.72
半導体2026/09/25@TechDesk
Qualcomm's Dragonfly AI250 With High Bandwidth Compute Due in 2027
Qualcomm N, 5775, Morehouse Drive, Barnes Canyon, Sorrento Mesa, San Diego, San Diego County, California, 92121, United StatesQualcomm
開始 2027/12/31推定確度 66%1.3 年後The October 2025 launch release says AI250 is 'expected to be commercially available in ... 2027', and the June 2026 roadmap expects 'Commercial sampling of HBC Gen 1 with AI250 ... in mid-2027'; a bare year is dated to 31 December.^[1]
Qualcomm's second-generation data-center AI accelerator, the Dragonfly AI250, is due in 2027 with High Bandwidth Compute near-memory stacking that gives 133 TB/s of effective bandwidth per card, 18 times the AI200.
0.70
半導体2026/09/25@TechDesk
Qualcomm Introduces Snapdragon C for Entry-Level Laptops
QualcommQualcomm N, 5775, Morehouse Drive, Barnes Canyon, Sorrento Mesa, San Diego, San Diego County, California, 92121, United States
開始 2026/05/28 13:00確定確度 86%120 日前The release is datelined 'May 28, 2026 | SAN DIEGO' and Qualcomm's^[1][2] page stamps it 13:00 UTC.
Qualcomm launched Snapdragon C, an entry-tier laptop processor with an integrated NPU for machines from about $300, with designs from Acer, HP and Lenovo aimed at students, families and small businesses.
0.69
カンファレンス2026/09/25@TechDesk
Snapdragon Summit 2025 in Maui
QualcommHyatt Regency Maui Resort and Spa, 200, Nohea Kai Drive, Lahaina, Maui County, Hawaii, 96761, United States
開始 2025/09/24 0:30確定確度 84%昨年Qualcomm's^[1][4][5] event page, archived during the event, says 'Snapdragon Summit is September 23 – 25, 2025 in Maui, Hawaii' and opens Day 1 (Tuesday, Sept 23) at '2:30 PM HT'; the recap itself gives no dates.
Qualcomm's tenth Snapdragon Summit ran three days in Maui, where it launched the Snapdragon 8 Elite Gen 5 phone chip and the 5 GHz Snapdragon X2 Elite Extreme and X2 Elite PC processors, with Google's Rick Osterloh, Adobe's Shantanu Narayen and HUMAIN's Tareq Amin on stage.
0.69
半導体2026/09/25@TechDesk
Qualcomm Unveils Snapdragon Reality Elite XR Chip at AWE 2026
Long Beach Convention Center, 300, East Ocean Boulevard, Long Beach, Los Angeles County, California, 90802, United StatesQualcomm
開始 2026/06/16 17:00確定確度 85%101 日前The release is dated Jun 16, 2026 ('Qualcomm^[1][2][3][4] Technologies Inc. today announced at Augmented World Expo the Snapdragon Reality Elite Platform') and Qualcomm's page stamps it 17:00 UTC.
At Augmented World Expo 2026 in Long Beach, Qualcomm launched Snapdragon Reality Elite, an XR platform with 48 TOPS of on-device AI and 4.4K-per-eye graphics that will power XREAL's Project Aura Android XR glasses.
0.68
カンファレンス2026/09/25@TechDesk
Cristiano Amon Opens COMPUTEX 2025 With Qualcomm's Keynote in Taipei
QualcommNangang Exhibition Center No2, 2, Jingmao 2nd Road, Sanzhong Village, Nangang District, Sanchongpu, Taipei, 115, Taiwan
開始 2025/05/19 6:00確定確度 88%1.3 年前COMPUTEX's organiser says 'The keynote will be on 14:00, May 19, (UTC+8), at Taipei Nangang Exhibition Center Hall 2, 7F', and Qualcomm's^[2][3] release lists 'May 19 from 2-3 p.m. Taiwan time'.
Qualcomm's CEO took the COMPUTEX 2025 keynote stage in Taipei a year after Snapdragon X entered the PC market, citing 85+ Snapdragon X PCs launched or in development and joined by Microsoft, ASUS, HP and Lenovo executives.
0.68
半導体2026/09/25@TechDesk
Qualcomm Launches Dragonfly Data Center Line: C1000 CPU and AI300 at Investor Day
QualcommManhattan, New York County, New York, United States
開始 2026/06/24 19:30確定確度 84%93 日前The release, dated Jun 24, 2026 and datelined NEW YORK, says Qualcomm^[1][2][3] 'today announced at its Investor Day' the new data center solutions; Qualcomm's page stamps it 19:30 UTC.
At its 2026 Investor Day in New York, Qualcomm branded its data-center products Dragonfly and unveiled the 250-plus-core Dragonfly C1000 CPU, the AI300 accelerator and High Bandwidth Compute memory, with Meta signed up for the CPU; the stock jumped 15%.
0.68

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参考資料 2確度 89%

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