电信2018/02/27@ThePinGang
5G 大规模部署
Intel
开始于 2020/06/15 已确认可信度 75%6.3年前已按日期发生，据 hexus.net^[1]：“……蜂窝调制解调器产品消息方面，XMM 7660 已经发布。这是一款 LTE 调制解调器，提供 Cat-19 能力……”
5G 有望为我们不可或缺的高科技智能联网设备带来更快的速度、更高的容量和更低的延迟。英特尔希望让 5G 过渡平稳无缝，为此设计了一套强大的端到端 5G 解决方案。英特尔 XMM 8000 系列是英特尔首个商用 5G 多模调制解调器系列，可在全球 6GHz 以下和毫米波频段工作。英特尔希望 XMM 8000 能在 PC、手机乃至汽车领域赢得大量设计订单。
0.77
半导体2026/09/25@TechDesk
Qualcomm Launches the 2 nm Snapdragon 8 Elite Extreme Gen 6 and 8 Elite Gen 6
QualcommMaui County, Hawaii, United States
开始于 2026/09/22 20:00已确认可信度 86%3天前The release is dated 'Sep 22, 2026 | MAUI' ('unveiled today') and Qualcomm's^[1][2][3][4] page stamps it 20:00 UTC, the 10:00 AM HT mobile keynote at Snapdragon Summit.
Qualcomm unveiled two flagship phone chips at Snapdragon Summit 2026 - the Snapdragon 8 Elite Extreme Gen 6 and 8 Elite Gen 6 - on a 2 nm process with 5 GHz Oryon cores, the X105 modem and Wi-Fi 8, for phones from Xiaomi, OnePlus, OPPO, vivo, Honor and Motorola.
0.73
半导体2026/09/25@TechDesk
Qualcomm Launches the Snapdragon X2 Plus at CES 2026
QualcommLas Vegas Convention Center West Hall Expansion, Vegas Loop, Las Vegas Convention Center, Filipino Town, Winchester, Clark County, Nevada, 89109, United States
开始于 2026/01/05 17:00已确认可信度 87%263天前The release is datelined 'Jan 5, 2026 | LAS VEGAS' ('At CES, Qualcomm^[1][2][3] Technologies, Inc. announced the Snapdragon X2 Plus platform') and Qualcomm's page stamps it 17:00 UTC.
At CES 2026 Qualcomm added the Snapdragon X2 Plus to its PC line, a 3 nm chip with up to 10 Oryon cores and an 80 TOPS NPU that brings X2-series performance and multi-day battery life to lower-priced Copilot+ laptops from the first half of 2026.
0.73
半导体2026/09/25@TechDesk
Qualcomm Unveils the 5 GHz Snapdragon X2 Elite Extreme and X2 Elite PC Chips
QualcommHyatt Regency Maui Resort and Spa, 200, Nohea Kai Drive, Lahaina, Maui County, Hawaii, 96761, United States
开始于 2025/09/24 20:30已确认可信度 85%去年The release is datelined MAUI and Qualcomm's^[1][2][3][4] page stamps it 24 Sep 2025 20:30 UTC, the 10:30 AM HT Product Announcements Keynote at Snapdragon Summit 2025.
Qualcomm unveiled the Snapdragon X2 Elite Extreme and X2 Elite, 3 nm Windows PC processors with up to 18 Oryon cores, the first Arm-compatible CPU to reach 5 GHz and an 80 TOPS NPU, for laptops in the first half of 2026.
0.73
半导体2017/06/15@ThePinGang
高通即将推出支持数千兆比特串流的三频 Wi-Fi 芯片
Qualcomm
2015/03/02至2015/03/15 已确认可信度 76%11.6年前已按日期发生，据 arstechnica.com^[1]：“……Gig。”骁龙 810 预计将于 2015 年上半年出货。高通未披露财……”
高通宣布已完成对 Wilocity 的收购，并将很快推出“一系列三频平台，结合 Qualcomm Atheros, Inc. 的 Wi-Fi 和 WiGig 解决方案，大幅提升性能并支持前沿无线应用。首款三频平台是基于高通骁龙 810 的参考设计，骁龙 810 是全球首款支持 WiGig 的移动平台。”骁龙 810 预计将于 2015 年上半年出货。
0.73
半导体2026/09/25@TechDesk
Qualcomm Launches the Snapdragon 8 Elite Gen 5 at Snapdragon Summit
QualcommHyatt Regency Maui Resort and Spa, 200, Nohea Kai Drive, Lahaina, Maui County, Hawaii, 96761, United States
开始于 2025/09/24 20:30已确认可信度 86%去年The release is datelined MAUI and Qualcomm's^[1][2][3][4] page stamps it 24 Sep 2025 20:30 UTC, the 10:30 AM HT start of the summit's Product Announcements Keynote.
Qualcomm unveiled the Snapdragon 8 Elite Gen 5, a 3 nm phone chip with a 4.74 GHz third-generation Oryon CPU that it called the world's fastest mobile system-on-a-chip, for flagships from Samsung, Xiaomi, OnePlus and a dozen other brands.
0.72
半导体2026/09/25@TechDesk
Qualcomm's Dragonfly AI250 With High Bandwidth Compute Due in 2027
Qualcomm N, 5775, Morehouse Drive, Barnes Canyon, Sorrento Mesa, San Diego, San Diego County, California, 92121, United StatesQualcomm
开始于 2027/12/31预估可信度 66%1.3年后The October 2025 launch release says AI250 is 'expected to be commercially available in ... 2027', and the June 2026 roadmap expects 'Commercial sampling of HBC Gen 1 with AI250 ... in mid-2027'; a bare year is dated to 31 December.^[1]
Qualcomm's second-generation data-center AI accelerator, the Dragonfly AI250, is due in 2027 with High Bandwidth Compute near-memory stacking that gives 133 TB/s of effective bandwidth per card, 18 times the AI200.
0.70
半导体2026/09/25@TechDesk
Qualcomm Introduces Snapdragon C for Entry-Level Laptops
QualcommQualcomm N, 5775, Morehouse Drive, Barnes Canyon, Sorrento Mesa, San Diego, San Diego County, California, 92121, United States
开始于 2026/05/28 13:00已确认可信度 86%120天前The release is datelined 'May 28, 2026 | SAN DIEGO' and Qualcomm's^[1][2] page stamps it 13:00 UTC.
Qualcomm launched Snapdragon C, an entry-tier laptop processor with an integrated NPU for machines from about $300, with designs from Acer, HP and Lenovo aimed at students, families and small businesses.
0.69
大会2026/09/25@TechDesk
Snapdragon Summit 2025 in Maui
QualcommHyatt Regency Maui Resort and Spa, 200, Nohea Kai Drive, Lahaina, Maui County, Hawaii, 96761, United States
开始于 2025/09/24 0:30已确认可信度 84%去年Qualcomm's^[1][4][5] event page, archived during the event, says 'Snapdragon Summit is September 23 – 25, 2025 in Maui, Hawaii' and opens Day 1 (Tuesday, Sept 23) at '2:30 PM HT'; the recap itself gives no dates.
Qualcomm's tenth Snapdragon Summit ran three days in Maui, where it launched the Snapdragon 8 Elite Gen 5 phone chip and the 5 GHz Snapdragon X2 Elite Extreme and X2 Elite PC processors, with Google's Rick Osterloh, Adobe's Shantanu Narayen and HUMAIN's Tareq Amin on stage.
0.69
半导体2026/09/25@TechDesk
Qualcomm Unveils Snapdragon Reality Elite XR Chip at AWE 2026
Long Beach Convention Center, 300, East Ocean Boulevard, Long Beach, Los Angeles County, California, 90802, United StatesQualcomm
开始于 2026/06/16 17:00已确认可信度 85%101天前The release is dated Jun 16, 2026 ('Qualcomm^[1][2][3][4] Technologies Inc. today announced at Augmented World Expo the Snapdragon Reality Elite Platform') and Qualcomm's page stamps it 17:00 UTC.
At Augmented World Expo 2026 in Long Beach, Qualcomm launched Snapdragon Reality Elite, an XR platform with 48 TOPS of on-device AI and 4.4K-per-eye graphics that will power XREAL's Project Aura Android XR glasses.
0.68
大会2026/09/25@TechDesk
Cristiano Amon Opens COMPUTEX 2025 With Qualcomm's Keynote in Taipei
QualcommNangang Exhibition Center No2, 2, Jingmao 2nd Road, Sanzhong Village, Nangang District, Sanchongpu, Taipei, 115, Taiwan
开始于 2025/05/19 6:00已确认可信度 88%1.3年前COMPUTEX's organiser says 'The keynote will be on 14:00, May 19, (UTC+8), at Taipei Nangang Exhibition Center Hall 2, 7F', and Qualcomm's^[2][3] release lists 'May 19 from 2-3 p.m. Taiwan time'.
Qualcomm's CEO took the COMPUTEX 2025 keynote stage in Taipei a year after Snapdragon X entered the PC market, citing 85+ Snapdragon X PCs launched or in development and joined by Microsoft, ASUS, HP and Lenovo executives.
0.68
半导体2026/09/25@TechDesk
Qualcomm Launches Dragonfly Data Center Line: C1000 CPU and AI300 at Investor Day
QualcommManhattan, New York County, New York, United States
开始于 2026/06/24 19:30已确认可信度 84%93天前The release, dated Jun 24, 2026 and datelined NEW YORK, says Qualcomm^[1][2][3] 'today announced at its Investor Day' the new data center solutions; Qualcomm's page stamps it 19:30 UTC.
At its 2026 Investor Day in New York, Qualcomm branded its data-center products Dragonfly and unveiled the 250-plus-core Dragonfly C1000 CPU, the AI300 accelerator and High Bandwidth Compute memory, with Meta signed up for the CPU; the stock jumped 15%.
0.68

The release is datelined 'Mar 2, 2026 | BARCELONA' and Qualcomm's^[1][2] page stamps it 07:00 UTC; it invites 'Attendees of MWC Barcelona' to booth 3E10.

开始: 2026年3月2日可信度 90%来自来源

Qualcomm Unveils the X105, the First 3GPP Release 19-Ready 5G Modem

At MWC Barcelona 2026 Qualcomm unveiled the X105 5G Modem-RF, the first modem ready for 3GPP Release 19, with 14.8 Gbps peak downloads, video calls over satellite and the first 6 nm RF transceiver, for devices in the second half of 2026.

Qualcomm announced the X105 5G Modem-RF at MWC Barcelona 2026 as the industry's first 3GPP Release 19-ready modem, laying groundwork for 6G development and testing^[1][2]
Its fifth-generation AI processor uses agentic AI inside the modem to classify and optimise traffic for gaming, calls and social media^[1]
Operators backing it included China Telecom, China Mobile, China Unicom, Deutsche Telekom, KDDI, Telstra, T-Mobile and NTT DOCOMO^[1]
It was sampling to customers, with commercial devices expected in the second half of 2026^[1]

Notable features

Peak 14.8 Gbps download (13.2 Gbps on sub-6 GHz) and 4.2 Gbps upload^[1][2]
First 6 nm RF transceiver: up to 30% lower power and 15% smaller board footprint than the previous generation^[1]
Integrated NR-NTN for video calls, streaming, data, voice and messaging over satellite^[1]
First quad-frequency (L1, L2, L5, L6) GNSS engine^[1]
500 MHz of aggregated bandwidth^[2]

@TechDesk

参考资料 2可信度 89%

第一项始终是图钉的来源。总体可信度是各份资料对上方所用开始和结束时间支持程度的加权平均；资料每比最新的一份旧 180 天，权重减半。

[1]90%
qualcomm.com/news/releases/2026/03/qualcomm-announces-5g-advanced-leap-with-qualcomm-x105-5g-modem-
qualcomm.com· 发布于 2026年9月25日· 开始 2026年3月2日 ✓· 占评分 50%
The release is datelined 'Mar 2, 2026 | BARCELONA' and Qualcomm's^[2] page stamps it 07:00 UTC; it invites 'Attendees of MWC Barcelona' to booth 3E10.
[2]88%
Qualcomm X105 5G Modem-RF product page (Qualcomm)
qualcomm.com· 添加于 2026年9月25日· 占评分 50%
Product page: first 3GPP Release 19-ready modem-RF, 5th-generation 5G AI Processor, NR-NTN satellite, quad-frequency GNSS, first 6 nm RF transceiver cutting power 30%, 500 MHz aggregated bandwidth, 14.8 Gbps down and 4.2 Gbps up.^[1]

建议更正

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1Qualcomm Unveils the X105, the First 3GPP Release 19-Ready 5G Modem开始时为 US$141.03

电信2018/02/27@ThePinGang
5G 大规模部署
Intel
开始于 2020/06/15 已确认可信度 75%6.3年前已按日期发生，据 hexus.net^[1]：“……蜂窝调制解调器产品消息方面，XMM 7660 已经发布。这是一款 LTE 调制解调器，提供 Cat-19 能力……”
5G 有望为我们不可或缺的高科技智能联网设备带来更快的速度、更高的容量和更低的延迟。英特尔希望让 5G 过渡平稳无缝，为此设计了一套强大的端到端 5G 解决方案。英特尔 XMM 8000 系列是英特尔首个商用 5G 多模调制解调器系列，可在全球 6GHz 以下和毫米波频段工作。英特尔希望 XMM 8000 能在 PC、手机乃至汽车领域赢得大量设计订单。
0.77
半导体2026/09/25@TechDesk
Qualcomm Launches the 2 nm Snapdragon 8 Elite Extreme Gen 6 and 8 Elite Gen 6
QualcommMaui County, Hawaii, United States
开始于 2026/09/22 20:00已确认可信度 86%3天前The release is dated 'Sep 22, 2026 | MAUI' ('unveiled today') and Qualcomm's^[1][2][3][4] page stamps it 20:00 UTC, the 10:00 AM HT mobile keynote at Snapdragon Summit.
Qualcomm unveiled two flagship phone chips at Snapdragon Summit 2026 - the Snapdragon 8 Elite Extreme Gen 6 and 8 Elite Gen 6 - on a 2 nm process with 5 GHz Oryon cores, the X105 modem and Wi-Fi 8, for phones from Xiaomi, OnePlus, OPPO, vivo, Honor and Motorola.
0.73
半导体2026/09/25@TechDesk
Qualcomm Launches the Snapdragon X2 Plus at CES 2026
QualcommLas Vegas Convention Center West Hall Expansion, Vegas Loop, Las Vegas Convention Center, Filipino Town, Winchester, Clark County, Nevada, 89109, United States
开始于 2026/01/05 17:00已确认可信度 87%263天前The release is datelined 'Jan 5, 2026 | LAS VEGAS' ('At CES, Qualcomm^[1][2][3] Technologies, Inc. announced the Snapdragon X2 Plus platform') and Qualcomm's page stamps it 17:00 UTC.
At CES 2026 Qualcomm added the Snapdragon X2 Plus to its PC line, a 3 nm chip with up to 10 Oryon cores and an 80 TOPS NPU that brings X2-series performance and multi-day battery life to lower-priced Copilot+ laptops from the first half of 2026.
0.73
半导体2026/09/25@TechDesk
Qualcomm Unveils the 5 GHz Snapdragon X2 Elite Extreme and X2 Elite PC Chips
QualcommHyatt Regency Maui Resort and Spa, 200, Nohea Kai Drive, Lahaina, Maui County, Hawaii, 96761, United States
开始于 2025/09/24 20:30已确认可信度 85%去年The release is datelined MAUI and Qualcomm's^[1][2][3][4] page stamps it 24 Sep 2025 20:30 UTC, the 10:30 AM HT Product Announcements Keynote at Snapdragon Summit 2025.
Qualcomm unveiled the Snapdragon X2 Elite Extreme and X2 Elite, 3 nm Windows PC processors with up to 18 Oryon cores, the first Arm-compatible CPU to reach 5 GHz and an 80 TOPS NPU, for laptops in the first half of 2026.
0.73
半导体2017/06/15@ThePinGang
高通即将推出支持数千兆比特串流的三频 Wi-Fi 芯片
Qualcomm
2015/03/02至2015/03/15 已确认可信度 76%11.6年前已按日期发生，据 arstechnica.com^[1]：“……Gig。”骁龙 810 预计将于 2015 年上半年出货。高通未披露财……”
高通宣布已完成对 Wilocity 的收购，并将很快推出“一系列三频平台，结合 Qualcomm Atheros, Inc. 的 Wi-Fi 和 WiGig 解决方案，大幅提升性能并支持前沿无线应用。首款三频平台是基于高通骁龙 810 的参考设计，骁龙 810 是全球首款支持 WiGig 的移动平台。”骁龙 810 预计将于 2015 年上半年出货。
0.73
半导体2026/09/25@TechDesk
Qualcomm Launches the Snapdragon 8 Elite Gen 5 at Snapdragon Summit
QualcommHyatt Regency Maui Resort and Spa, 200, Nohea Kai Drive, Lahaina, Maui County, Hawaii, 96761, United States
开始于 2025/09/24 20:30已确认可信度 86%去年The release is datelined MAUI and Qualcomm's^[1][2][3][4] page stamps it 24 Sep 2025 20:30 UTC, the 10:30 AM HT start of the summit's Product Announcements Keynote.
Qualcomm unveiled the Snapdragon 8 Elite Gen 5, a 3 nm phone chip with a 4.74 GHz third-generation Oryon CPU that it called the world's fastest mobile system-on-a-chip, for flagships from Samsung, Xiaomi, OnePlus and a dozen other brands.
0.72
半导体2026/09/25@TechDesk
Qualcomm's Dragonfly AI250 With High Bandwidth Compute Due in 2027
Qualcomm N, 5775, Morehouse Drive, Barnes Canyon, Sorrento Mesa, San Diego, San Diego County, California, 92121, United StatesQualcomm
开始于 2027/12/31预估可信度 66%1.3年后The October 2025 launch release says AI250 is 'expected to be commercially available in ... 2027', and the June 2026 roadmap expects 'Commercial sampling of HBC Gen 1 with AI250 ... in mid-2027'; a bare year is dated to 31 December.^[1]
Qualcomm's second-generation data-center AI accelerator, the Dragonfly AI250, is due in 2027 with High Bandwidth Compute near-memory stacking that gives 133 TB/s of effective bandwidth per card, 18 times the AI200.
0.70
半导体2026/09/25@TechDesk
Qualcomm Introduces Snapdragon C for Entry-Level Laptops
QualcommQualcomm N, 5775, Morehouse Drive, Barnes Canyon, Sorrento Mesa, San Diego, San Diego County, California, 92121, United States
开始于 2026/05/28 13:00已确认可信度 86%120天前The release is datelined 'May 28, 2026 | SAN DIEGO' and Qualcomm's^[1][2] page stamps it 13:00 UTC.
Qualcomm launched Snapdragon C, an entry-tier laptop processor with an integrated NPU for machines from about $300, with designs from Acer, HP and Lenovo aimed at students, families and small businesses.
0.69
大会2026/09/25@TechDesk
Snapdragon Summit 2025 in Maui
QualcommHyatt Regency Maui Resort and Spa, 200, Nohea Kai Drive, Lahaina, Maui County, Hawaii, 96761, United States
开始于 2025/09/24 0:30已确认可信度 84%去年Qualcomm's^[1][4][5] event page, archived during the event, says 'Snapdragon Summit is September 23 – 25, 2025 in Maui, Hawaii' and opens Day 1 (Tuesday, Sept 23) at '2:30 PM HT'; the recap itself gives no dates.
Qualcomm's tenth Snapdragon Summit ran three days in Maui, where it launched the Snapdragon 8 Elite Gen 5 phone chip and the 5 GHz Snapdragon X2 Elite Extreme and X2 Elite PC processors, with Google's Rick Osterloh, Adobe's Shantanu Narayen and HUMAIN's Tareq Amin on stage.
0.69
半导体2026/09/25@TechDesk
Qualcomm Unveils Snapdragon Reality Elite XR Chip at AWE 2026
Long Beach Convention Center, 300, East Ocean Boulevard, Long Beach, Los Angeles County, California, 90802, United StatesQualcomm
开始于 2026/06/16 17:00已确认可信度 85%101天前The release is dated Jun 16, 2026 ('Qualcomm^[1][2][3][4] Technologies Inc. today announced at Augmented World Expo the Snapdragon Reality Elite Platform') and Qualcomm's page stamps it 17:00 UTC.
At Augmented World Expo 2026 in Long Beach, Qualcomm launched Snapdragon Reality Elite, an XR platform with 48 TOPS of on-device AI and 4.4K-per-eye graphics that will power XREAL's Project Aura Android XR glasses.
0.68
大会2026/09/25@TechDesk
Cristiano Amon Opens COMPUTEX 2025 With Qualcomm's Keynote in Taipei
QualcommNangang Exhibition Center No2, 2, Jingmao 2nd Road, Sanzhong Village, Nangang District, Sanchongpu, Taipei, 115, Taiwan
开始于 2025/05/19 6:00已确认可信度 88%1.3年前COMPUTEX's organiser says 'The keynote will be on 14:00, May 19, (UTC+8), at Taipei Nangang Exhibition Center Hall 2, 7F', and Qualcomm's^[2][3] release lists 'May 19 from 2-3 p.m. Taiwan time'.
Qualcomm's CEO took the COMPUTEX 2025 keynote stage in Taipei a year after Snapdragon X entered the PC market, citing 85+ Snapdragon X PCs launched or in development and joined by Microsoft, ASUS, HP and Lenovo executives.
0.68
半导体2026/09/25@TechDesk
Qualcomm Launches Dragonfly Data Center Line: C1000 CPU and AI300 at Investor Day
QualcommManhattan, New York County, New York, United States
开始于 2026/06/24 19:30已确认可信度 84%93天前The release, dated Jun 24, 2026 and datelined NEW YORK, says Qualcomm^[1][2][3] 'today announced at its Investor Day' the new data center solutions; Qualcomm's page stamps it 19:30 UTC.
At its 2026 Investor Day in New York, Qualcomm branded its data-center products Dragonfly and unveiled the 250-plus-core Dragonfly C1000 CPU, the AI300 accelerator and High Bandwidth Compute memory, with Meta signed up for the CPU; the stock jumped 15%.
0.68

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Notable features

参考资料 2可信度 89%

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