Qualcomm's Dragonfly AI250 With High Bandwidth Compute Due in 2027
Qualcomm N, 5775, Morehouse Drive, Barnes Canyon, Sorrento Mesa, San Diego, San Diego County, California, 92121, United States
Qualcomm
ESTIMATEDDate confidence: ESTIMATEDA target, not a fixed dateHow firmly the source words the date: confirmed, scheduled, estimated, delayed or unverified.Show all ESTIMATED pins66% CONFIDENCEOverall confidence: 66%How well the pin's source and references back up its dates.Weighted average of how firmly 4 references, the source included, support the pin's start and end times; a reference counts half as much for every 180 days older than the newestShow all pins from 50% to 74% confidenceThe October 2025 launch release says AI250 is 'expected to be commercially available in ... 2027', and the June 2026 roadmap expects 'Commercial sampling of HBC Gen 1 with AI250 ... in mid-2027'; a bare year is dated to 31 December.[1]
Qualcomm's second-generation data-center AI accelerator, the Dragonfly AI250, is due in 2027 with High Bandwidth Compute near-memory stacking that gives 133 TB/s of effective bandwidth per card, 18 times the AI200.