Semiconductores23/09/2026@TechDesk
TSMC's Second Kumamoto Fab (JASM) Starts 3nm Volume Production
TSMC…JASM, Haramizu, Kikuyo, Kikuchi County, Kumamoto Prefecture 869-1103, Japan
Empieza el 31/12/2028ESTIMADO12 meses de retraso71% DE CONFIANZAdentro de 2,3 añosOnly a year is given: Taiwan's MOEA says the fab is "scheduled to start installing equipment and come online in 2028", and C.C. Wei said on the 16 April 2026 call that "commercial production is scheduled to begin in 2028" - so the year's last day, estimated.^[1]
JASM's second fab in Kikuyo, Kumamoto - switched from 6nm-class chips to TSMC's 3nm process - is due to start volume production in 2028 at 15,000 12-inch wafers a month, making Japan's first 3nm chips about a year after the end-2027 start TSMC first promised.
$17B
0.79
Semiconductores23/09/2026@TechDesk
TSMC's 1.6nm-Class A16 Process Enters Volume Production
TSMC…TSMC headquarters, 8 Lixing 6th Road, Baoshan, Hsinchu County 30082, Taiwan
Empieza el 31/12/2027RETRASADO12 meses de retraso67% DE CONFIANZAdentro de 1,3 añosTSMC's^[2][5] Kevin Zhang told Tom's Hardware "A16 will be ready for production in 2026... we expect volume production to begin in 2027", and TSMC's roadmap slide lists A16 under 2027; with no quarter named, the year's last day stands in.
A16, TSMC's first node with Super Power Rail backside power delivery, is expected to reach volume production in 2027, a year after the 2026 production TSMC planned when it unveiled the node.
0.74
Semiconductores23/09/2026@TechDesk
TSMC's Third Arizona Fab Starts Volume Production on N2 and A16
TSMC…P3, TSMC Arizona Fab 21, F Road, North Gateway, Phoenix, Maricopa County, Arizona 85085, United States
Empieza el 31/12/2029ESTIMADO 58% DE CONFIANZAdentro de 3,3 añosTSMC's^[1][4] Arizona page gives only a span: "Third Fab: In April 2025, TSMC broke ground on the site of the third fab, slated for N2 and A16 process technologies. Targeting volume production by the end of the decade." - so the decade's last day, estimated.
The third fab on TSMC's north Phoenix campus, where ground was broken in April 2025, is slated for its 2nm (N2) and A16 processes and targeted for volume production by the end of the decade - the most advanced chipmaking TSMC has committed to the United States.
0.74
Semiconductores23/09/2026@TechDesk
TSMC's Dresden Fab (ESMC) Starts Production
TSMC…European Semiconductor Manufacturing Company (ESMC) GmbH, Robert-Bosch-Ring, Hellerau/Wilschdorf, 01109 Dresden, Saxony, Germany
Empieza el 31/12/2027ESTIMADO 73% DE CONFIANZAdentro de 1,3 añosTSMC's^[1][6] founding release gives a bound, not a day: "production targeted to begin by the end of 2027"; at the September 2026 topping-out the partners still said production starts in 2027 and Hardwareluxx^[3] reported tool installation "bis Ende 2027", after which the first chips follow - so 31 December 2027, estimated.
ESMC, TSMC's EUR 10 billion joint venture with Bosch, Infineon and NXP, is due to start production at its Dresden fab by the end of 2027 - Europe's first FinFET-capable foundry, making 28/22nm and 16/12nm chips mainly for cars and industry.
€10B
0.73
Semiconductores21/06/2017@ThePinGang
In December last year TSMC started to work on its 5nm process
TSMC
Empieza el 31/03/2020 CONFIRMADO 79% DE CONFIANZAhace 6,5 añosHappened as dated, per hexus.net^[1]: "…progress of these plans, with a target launch date set for H1 2020. Now a recent report suggests th…"
In December last year TSMC started to work on its 5nm process. In the following January we heard from the firm's CEO about the progress of these plans, with a target launch date set for H1 2020. Now a recent report suggests that TSMC is confident of reaching its previously publicised goals, as it has started to allocate between 300 and 400 R&D staff to work on developing its 3nm process.
0.72
Semiconductores21/06/2017@ThePinGang
GLOBALFOUNDRIES will jump directly from 14nm to 7nm
GLOBALFOUNDRIES…
Empieza el 30/03/2018 CONFIRMADO 79% DE CONFIANZAhace 8,5 añosHappened as dated, per hexus.net^[1]: "…xf Add to My Vault: GLOBALFOUNDRIES has announced that it plans to power straight through to 7nm Fin…"
Tech expected to be ready for chip designers in H2 2017, production in early 2018. It will skip "the marginal performance and power benefits for the high cost of the 10nm process node" to hopefully become a leading differentiated 7nm chip fabricator ahead of major rivals.
0.71
Semiconductores23/09/2026@TechDesk
TSMC's Dresden Fab (ESMC) Tops Out
TSMC…European Semiconductor Manufacturing Company (ESMC) GmbH, Robert-Bosch-Ring, Hellerau/Wilschdorf, 01109 Dresden, Saxony, Germany
Empieza el 14/09/2026 10:00CONFIRMADO 80% DE CONFIANZAhace 9 díasFocus Taiwan^[1]: "A topping out ceremony was held Monday at the site" (dateline Sept. 14, "The ceremony, held on Sept. 14"); dpa's preview gave the time: ESMC "feiert ... am Montag (12.00 Uhr) mit einem Richtfest den Abschluss des Rohbaus" - noon CEST, 10:00 UTC.
Twenty-five months after its groundbreaking, ESMC - TSMC's joint venture with Bosch, Infineon and NXP - celebrated the topping-out of its roughly EUR 10 billion chip fab in Dresden, TSMC's first in Europe. The shell is finished; cleanroom fit-out follows, with the first process tools due in the second half of 2027.
€10B
0.70
Semiconductores23/09/2026@LawDesk
Taiwan Indicts Three Engineers Over the Theft of TSMC's 2nm Secrets
Intellectual Property Branch, Taiwan High Prosecutors Office, 164 Bo'ai Road, Zhongzheng District, Taipei 100006, Taiwan
Empieza el 27/08/2025CONFIRMADO 85% DE CONFIANZAhace 1,1 añosThe Intellectual Property Branch's own release, posted 114-08-27 (27 August 2025), says the case against the three detained defendants 'was concluded today (27th)' ('於今（27）日偵查終結') and an indictment filed; no time is given, so it is an all-day date.^[1]
Prosecutors charged former TSMC engineer Chen Li-ming, by then at Tokyo Electron's Taiwan unit, and two serving TSMC engineers with stealing 2nm trade secrets, seeking 14, 9 and 7 years in Taiwan's first indictment for theft of a national core key technology.
0.69
Semiconductores20/09/2026@BuildDesk
TSMC's Second Arizona Fab Starts Mass Production
TSMC Arizona campus, N 43rd Avenue at W Dove Valley Road, Phoenix, AZ 85085TSMC
Empieza el 01/07/2027ESTIMADO 72% DE CONFIANZAdentro de 281 díasTSMC^[2] said it had "pushed up the mass production schedule for its second wafer fab in the U.S. state of Arizona to the second half of 2027 from the previously planned 2028," naming a half-year rather than a day.
The second fab on TSMC's north Phoenix campus, whose structure was finished in 2025, is due to begin high-volume manufacturing in the second half of 2027 - a year earlier than the schedule the company had previously given. Chairman C.C. Wei gave the pulled-forward date on 15 January 2026; the campus is the centrepiece of a $165 billion Arizona investment.
0.68
Semiconductores23/09/2026@TechDesk
US and Taiwan Sign a $250 Billion Chip Investment Deal
TSMC…U.S. Department of Commerce, 1401 Constitution Avenue Northwest, Washington, DC 20230, United States
Empieza el 15/01/2026CONFIRMADO 86% DE CONFIANZAhace 251 díasCNBC^[1], published 15 January 2026: 'The U.S. and Taiwan have reached a trade agreement ... the Department of Commerce announced Thursday'; USTR's^[2] February fact sheet dates the 'Memorandum of Understanding signed by AIT and TECRO on January 15, 2026'. No signing time is given, so it is an all-day date.
A memorandum signed in Washington commits Taiwanese chipmakers such as TSMC to at least $250 billion of new US investment plus $250 billion in Taiwan credit guarantees, in return for a 15% tariff cap and Section 232 chip-tariff exemptions for companies building US fabs.
0.68
Semiconductores15/09/2026@BuildDesk
Bosch Opens €1 Billion Chip Fab in Dresden
Dresden-Hellerau, Dresden, GermanyBosch
Empieza el 07/06/2021CONFIRMADO 90% DE CONFIANZAhace 5,3 añosBosch's own media release, "Bosch opens chip factory of the future in Dresden," states the fab was opened on 7 June 2021.^[1]
Bosch opened its new 300mm wafer fab in Dresden, a roughly €1 billion, highly automated plant producing sensors and microchips for cars and consumer electronics.
0.67
Semiconductores20/09/2026@BuildDesk
Texas Instruments Starts Production at Its Sherman SM1 Fab
Texas Instruments Sherman site, US-75 at Shepherd Road, Sherman, TX 75090, United StatesTexas Instruments…
Empieza el 17/12/2025CONFIRMADO 90% DE CONFIANZAhace 280 díasTI's news release is dated "17 DEC 2025" and announces that it "begins production at its newest 300mm semiconductor manufacturing facility in Sherman, Texas".^[1]
TI began production at SM1, the first 300mm wafer fab on its site off US-75 at Shepherd Road in Sherman, three and a half years after breaking ground. The site is laid out for up to four connected fabs and is meant to support as many as 3,000 direct jobs; TI is spending more than $60 billion across seven fabs in Texas and Utah.
0.67

TSMC's^[1][2] 2nm page says N2 "has started volume production in 4Q25 as planned" and its 2025 annual report that it "entered high volume manufacturing in 4Q'25"; neither names the day, so the quarter's last day stands in.

Inicio: 31 dic 202550% DE CONFIANZAsegún la fuente

TSMC Starts Volume Production of 2nm (N2) Chips in Kaohsiung

TSMC's first nanosheet-transistor node, N2, entered volume production in the fourth quarter of 2025 as planned, starting at Fab 22 in Kaohsiung, with Fab 20 in Hsinchu as its second 2nm fab.

TSMC says its 2nm (N2) technology "has started volume production in 4Q25 as planned", and names Fab 20 (Hsinchu) and Fab 22 (Kaohsiung) as its 2nm production facilities^[1]
N2 is TSMC's first node with nanosheet (gate-all-around) transistors, backed by a low-resistance redistribution layer and super-high-performance MiM capacitors; N2P follows, with volume production scheduled for the second half of 2026^[1]
TSMC's 2025 annual report says N2 entered high-volume manufacturing in 4Q'25 "with good yield" and expects "a fast ramp in 2026"^[2]
Production began at Fab 22 near Kaohsiung rather than at Fab 20 beside TSMC's Hsinchu R&D center, where it had been expected to start^[3][5]
Against N3E, N2 gives 10-15% more speed at the same power or 25-30% less power at the same speed, and about 15% more transistor density for mixed logic, analog and SRAM designs^[4][5]
TSMC announced the milestone quietly, with an update to its technology page rather than a press release^[3][4]

@TechDesk

Referencias 573% DE CONFIANZA

La primera entrada es siempre la fuente del pin. La confianza global es una media ponderada de la firmeza con la que cada referencia respalda las horas de inicio y fin usadas arriba; una referencia cuenta la mitad por cada 180 días que sea más antigua que la más reciente.

[1]50%
tsmc.com/english/dedicatedFoundry/technology/logic/l_2nm
tsmc.com· Publicado el 23 sept 2026· Empieza 31 dic 2025 ✓· 33% de la puntuación
TSMC's^[2] 2nm page says N2 "has started volume production in 4Q25 as planned" and its 2025 annual report that it "entered high volume manufacturing in 4Q'25"; neither names the day, so the quarter's last day stands in.
[2]90%
TSMC 2025 Annual Report
investor.tsmc.com· Añadido el 23 sept 2026· 33% de la puntuación
TSMC's^[1] own annual report states "Our 2-nanometer technology successfully entered high volume manufacturing in 4Q'25, with good yield, and we expect a fast ramp in 2026."
[3]80%
TSMC officially begins 2nm chip volume production in Q4 2025
taipeitimes.com· Publicado el 31 dic 2025· 12% de la puntuación
The Taipei Times (CNA) says TSMC^[1][2] "officially began volume production of its 2-nanometer chips in the fourth quarter of 2025", that production is "centered at Fab 22 in Kaohsiung", and that the website update was the first official confirmation.
[4]75%
TSMC's 2nm N2 process officially enters volume production
techspot.com· Publicado el 30 dic 2025· 12% de la puntuación
TechSpot notes TSMC^[1][2] disclosed the milestone on its website rather than in a press release, "fulfilling its goal to begin production in the fourth quarter of 2025", with fabrication starting at Kaohsiung.
[5]82%
TSMC begins quietly volume production of 2nm-class chips
tomshardware.com· Publicado el 29 dic 2025· 12% de la puntuación
Tom's Hardware reports TSMC^[1][2] began N2 volume production "as planned" in 4Q25, at Fab 22 near Kaohsiung rather than Fab 20 near Hsinchu as expected, and lists N2's gains over N3E.

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Semiconductores23/09/2026@TechDesk
TSMC's Second Kumamoto Fab (JASM) Starts 3nm Volume Production
TSMC…JASM, Haramizu, Kikuyo, Kikuchi County, Kumamoto Prefecture 869-1103, Japan
Empieza el 31/12/2028ESTIMADO12 meses de retraso71% DE CONFIANZAdentro de 2,3 añosOnly a year is given: Taiwan's MOEA says the fab is "scheduled to start installing equipment and come online in 2028", and C.C. Wei said on the 16 April 2026 call that "commercial production is scheduled to begin in 2028" - so the year's last day, estimated.^[1]
JASM's second fab in Kikuyo, Kumamoto - switched from 6nm-class chips to TSMC's 3nm process - is due to start volume production in 2028 at 15,000 12-inch wafers a month, making Japan's first 3nm chips about a year after the end-2027 start TSMC first promised.
$17B
0.79
Semiconductores23/09/2026@TechDesk
TSMC's 1.6nm-Class A16 Process Enters Volume Production
TSMC…TSMC headquarters, 8 Lixing 6th Road, Baoshan, Hsinchu County 30082, Taiwan
Empieza el 31/12/2027RETRASADO12 meses de retraso67% DE CONFIANZAdentro de 1,3 añosTSMC's^[2][5] Kevin Zhang told Tom's Hardware "A16 will be ready for production in 2026... we expect volume production to begin in 2027", and TSMC's roadmap slide lists A16 under 2027; with no quarter named, the year's last day stands in.
A16, TSMC's first node with Super Power Rail backside power delivery, is expected to reach volume production in 2027, a year after the 2026 production TSMC planned when it unveiled the node.
0.74
Semiconductores23/09/2026@TechDesk
TSMC's Third Arizona Fab Starts Volume Production on N2 and A16
TSMC…P3, TSMC Arizona Fab 21, F Road, North Gateway, Phoenix, Maricopa County, Arizona 85085, United States
Empieza el 31/12/2029ESTIMADO 58% DE CONFIANZAdentro de 3,3 añosTSMC's^[1][4] Arizona page gives only a span: "Third Fab: In April 2025, TSMC broke ground on the site of the third fab, slated for N2 and A16 process technologies. Targeting volume production by the end of the decade." - so the decade's last day, estimated.
The third fab on TSMC's north Phoenix campus, where ground was broken in April 2025, is slated for its 2nm (N2) and A16 processes and targeted for volume production by the end of the decade - the most advanced chipmaking TSMC has committed to the United States.
0.74
Semiconductores23/09/2026@TechDesk
TSMC's Dresden Fab (ESMC) Starts Production
TSMC…European Semiconductor Manufacturing Company (ESMC) GmbH, Robert-Bosch-Ring, Hellerau/Wilschdorf, 01109 Dresden, Saxony, Germany
Empieza el 31/12/2027ESTIMADO 73% DE CONFIANZAdentro de 1,3 añosTSMC's^[1][6] founding release gives a bound, not a day: "production targeted to begin by the end of 2027"; at the September 2026 topping-out the partners still said production starts in 2027 and Hardwareluxx^[3] reported tool installation "bis Ende 2027", after which the first chips follow - so 31 December 2027, estimated.
ESMC, TSMC's EUR 10 billion joint venture with Bosch, Infineon and NXP, is due to start production at its Dresden fab by the end of 2027 - Europe's first FinFET-capable foundry, making 28/22nm and 16/12nm chips mainly for cars and industry.
€10B
0.73
Semiconductores21/06/2017@ThePinGang
In December last year TSMC started to work on its 5nm process
TSMC
Empieza el 31/03/2020 CONFIRMADO 79% DE CONFIANZAhace 6,5 añosHappened as dated, per hexus.net^[1]: "…progress of these plans, with a target launch date set for H1 2020. Now a recent report suggests th…"
In December last year TSMC started to work on its 5nm process. In the following January we heard from the firm's CEO about the progress of these plans, with a target launch date set for H1 2020. Now a recent report suggests that TSMC is confident of reaching its previously publicised goals, as it has started to allocate between 300 and 400 R&D staff to work on developing its 3nm process.
0.72
Semiconductores21/06/2017@ThePinGang
GLOBALFOUNDRIES will jump directly from 14nm to 7nm
GLOBALFOUNDRIES…
Empieza el 30/03/2018 CONFIRMADO 79% DE CONFIANZAhace 8,5 añosHappened as dated, per hexus.net^[1]: "…xf Add to My Vault: GLOBALFOUNDRIES has announced that it plans to power straight through to 7nm Fin…"
Tech expected to be ready for chip designers in H2 2017, production in early 2018. It will skip "the marginal performance and power benefits for the high cost of the 10nm process node" to hopefully become a leading differentiated 7nm chip fabricator ahead of major rivals.
0.71
Semiconductores23/09/2026@TechDesk
TSMC's Dresden Fab (ESMC) Tops Out
TSMC…European Semiconductor Manufacturing Company (ESMC) GmbH, Robert-Bosch-Ring, Hellerau/Wilschdorf, 01109 Dresden, Saxony, Germany
Empieza el 14/09/2026 10:00CONFIRMADO 80% DE CONFIANZAhace 9 díasFocus Taiwan^[1]: "A topping out ceremony was held Monday at the site" (dateline Sept. 14, "The ceremony, held on Sept. 14"); dpa's preview gave the time: ESMC "feiert ... am Montag (12.00 Uhr) mit einem Richtfest den Abschluss des Rohbaus" - noon CEST, 10:00 UTC.
Twenty-five months after its groundbreaking, ESMC - TSMC's joint venture with Bosch, Infineon and NXP - celebrated the topping-out of its roughly EUR 10 billion chip fab in Dresden, TSMC's first in Europe. The shell is finished; cleanroom fit-out follows, with the first process tools due in the second half of 2027.
€10B
0.70
Semiconductores23/09/2026@LawDesk
Taiwan Indicts Three Engineers Over the Theft of TSMC's 2nm Secrets
Intellectual Property Branch, Taiwan High Prosecutors Office, 164 Bo'ai Road, Zhongzheng District, Taipei 100006, Taiwan
Empieza el 27/08/2025CONFIRMADO 85% DE CONFIANZAhace 1,1 añosThe Intellectual Property Branch's own release, posted 114-08-27 (27 August 2025), says the case against the three detained defendants 'was concluded today (27th)' ('於今（27）日偵查終結') and an indictment filed; no time is given, so it is an all-day date.^[1]
Prosecutors charged former TSMC engineer Chen Li-ming, by then at Tokyo Electron's Taiwan unit, and two serving TSMC engineers with stealing 2nm trade secrets, seeking 14, 9 and 7 years in Taiwan's first indictment for theft of a national core key technology.
0.69
Semiconductores20/09/2026@BuildDesk
TSMC's Second Arizona Fab Starts Mass Production
TSMC Arizona campus, N 43rd Avenue at W Dove Valley Road, Phoenix, AZ 85085TSMC
Empieza el 01/07/2027ESTIMADO 72% DE CONFIANZAdentro de 281 díasTSMC^[2] said it had "pushed up the mass production schedule for its second wafer fab in the U.S. state of Arizona to the second half of 2027 from the previously planned 2028," naming a half-year rather than a day.
The second fab on TSMC's north Phoenix campus, whose structure was finished in 2025, is due to begin high-volume manufacturing in the second half of 2027 - a year earlier than the schedule the company had previously given. Chairman C.C. Wei gave the pulled-forward date on 15 January 2026; the campus is the centrepiece of a $165 billion Arizona investment.
0.68
Semiconductores23/09/2026@TechDesk
US and Taiwan Sign a $250 Billion Chip Investment Deal
TSMC…U.S. Department of Commerce, 1401 Constitution Avenue Northwest, Washington, DC 20230, United States
Empieza el 15/01/2026CONFIRMADO 86% DE CONFIANZAhace 251 díasCNBC^[1], published 15 January 2026: 'The U.S. and Taiwan have reached a trade agreement ... the Department of Commerce announced Thursday'; USTR's^[2] February fact sheet dates the 'Memorandum of Understanding signed by AIT and TECRO on January 15, 2026'. No signing time is given, so it is an all-day date.
A memorandum signed in Washington commits Taiwanese chipmakers such as TSMC to at least $250 billion of new US investment plus $250 billion in Taiwan credit guarantees, in return for a 15% tariff cap and Section 232 chip-tariff exemptions for companies building US fabs.
0.68
Semiconductores15/09/2026@BuildDesk
Bosch Opens €1 Billion Chip Fab in Dresden
Dresden-Hellerau, Dresden, GermanyBosch
Empieza el 07/06/2021CONFIRMADO 90% DE CONFIANZAhace 5,3 añosBosch's own media release, "Bosch opens chip factory of the future in Dresden," states the fab was opened on 7 June 2021.^[1]
Bosch opened its new 300mm wafer fab in Dresden, a roughly €1 billion, highly automated plant producing sensors and microchips for cars and consumer electronics.
0.67
Semiconductores20/09/2026@BuildDesk
Texas Instruments Starts Production at Its Sherman SM1 Fab
Texas Instruments Sherman site, US-75 at Shepherd Road, Sherman, TX 75090, United StatesTexas Instruments…
Empieza el 17/12/2025CONFIRMADO 90% DE CONFIANZAhace 280 díasTI's news release is dated "17 DEC 2025" and announces that it "begins production at its newest 300mm semiconductor manufacturing facility in Sherman, Texas".^[1]
TI began production at SM1, the first 300mm wafer fab on its site off US-75 at Shepherd Road in Sherman, three and a half years after breaking ground. The site is laid out for up to four connected fabs and is meant to support as many as 3,000 direct jobs; TI is spending more than $60 billion across seven fabs in Texas and Utah.
0.67

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