TSMC's Dresden Fab (ESMC) Tops Out
CONFIRMÉCONFIANCE 80 %Focus Taiwan[1]: "A topping out ceremony was held Monday at the site" (dateline Sept. 14, "The ceremony, held on Sept. 14"); dpa's preview gave the time: ESMC "feiert ... am Montag (12.00 Uhr) mit einem Richtfest den Abschluss des Rohbaus" - noon CEST, 10:00 UTC.
Twenty-five months after its groundbreaking, ESMC - TSMC's joint venture with Bosch, Infineon and NXP - celebrated the topping-out of its roughly EUR 10 billion chip fab in Dresden, TSMC's first in Europe. The shell is finished; cleanroom fit-out follows, with the first process tools due in the second half of 2027.
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