半导体2026/09/23@TechDesk
TSMC's Second Kumamoto Fab (JASM) Starts 3nm Volume Production
TSMC…JASM, Haramizu, Kikuyo, Kikuchi County, Kumamoto Prefecture 869-1103, Japan
开始于 2028/12/31预估延期12个月可信度 71%2.3年后Only a year is given: Taiwan's MOEA says the fab is "scheduled to start installing equipment and come online in 2028", and C.C. Wei said on the 16 April 2026 call that "commercial production is scheduled to begin in 2028" - so the year's last day, estimated.^[1]
JASM's second fab in Kikuyo, Kumamoto - switched from 6nm-class chips to TSMC's 3nm process - is due to start volume production in 2028 at 15,000 12-inch wafers a month, making Japan's first 3nm chips about a year after the end-2027 start TSMC first promised.
$17B
0.79
半导体2026/09/23@TechDesk
TSMC's 1.6nm-Class A16 Process Enters Volume Production
TSMC…TSMC headquarters, 8 Lixing 6th Road, Baoshan, Hsinchu County 30082, Taiwan
开始于 2027/12/31已延期延期12个月可信度 67%1.3年后TSMC's^[2][5] Kevin Zhang told Tom's Hardware "A16 will be ready for production in 2026... we expect volume production to begin in 2027", and TSMC's roadmap slide lists A16 under 2027; with no quarter named, the year's last day stands in.
A16, TSMC's first node with Super Power Rail backside power delivery, is expected to reach volume production in 2027, a year after the 2026 production TSMC planned when it unveiled the node.
0.74
半导体2026/09/23@TechDesk
TSMC's Third Arizona Fab Starts Volume Production on N2 and A16
TSMC…P3, TSMC Arizona Fab 21, F Road, North Gateway, Phoenix, Maricopa County, Arizona 85085, United States
开始于 2029/12/31预估可信度 58%3.3年后TSMC's^[1][4] Arizona page gives only a span: "Third Fab: In April 2025, TSMC broke ground on the site of the third fab, slated for N2 and A16 process technologies. Targeting volume production by the end of the decade." - so the decade's last day, estimated.
The third fab on TSMC's north Phoenix campus, where ground was broken in April 2025, is slated for its 2nm (N2) and A16 processes and targeted for volume production by the end of the decade - the most advanced chipmaking TSMC has committed to the United States.
0.74
半导体2026/09/23@TechDesk
TSMC's Dresden Fab (ESMC) Starts Production
TSMC…European Semiconductor Manufacturing Company (ESMC) GmbH, Robert-Bosch-Ring, Hellerau/Wilschdorf, 01109 Dresden, Saxony, Germany
开始于 2027/12/31预估可信度 73%1.3年后TSMC's^[1][6] founding release gives a bound, not a day: "production targeted to begin by the end of 2027"; at the September 2026 topping-out the partners still said production starts in 2027 and Hardwareluxx^[3] reported tool installation "bis Ende 2027", after which the first chips follow - so 31 December 2027, estimated.
ESMC, TSMC's EUR 10 billion joint venture with Bosch, Infineon and NXP, is due to start production at its Dresden fab by the end of 2027 - Europe's first FinFET-capable foundry, making 28/22nm and 16/12nm chips mainly for cars and industry.
€10B
0.73
半导体2017/06/21@ThePinGang
In December last year TSMC started to work on its 5nm process
TSMC
开始于 2020/03/31 已确认可信度 79%6.5年前Happened as dated, per hexus.net^[1]: "…progress of these plans, with a target launch date set for H1 2020. Now a recent report suggests th…"
In December last year TSMC started to work on its 5nm process. In the following January we heard from the firm's CEO about the progress of these plans, with a target launch date set for H1 2020. Now a recent report suggests that TSMC is confident of reaching its previously publicised goals, as it has started to allocate between 300 and 400 R&D staff to work on developing its 3nm process.
0.72
半导体2017/06/21@ThePinGang
GLOBALFOUNDRIES will jump directly from 14nm to 7nm
GLOBALFOUNDRIES…
开始于 2018/03/30 已确认可信度 79%8.5年前Happened as dated, per hexus.net^[1]: "…xf Add to My Vault: GLOBALFOUNDRIES has announced that it plans to power straight through to 7nm Fin…"
Tech expected to be ready for chip designers in H2 2017, production in early 2018. It will skip "the marginal performance and power benefits for the high cost of the 10nm process node" to hopefully become a leading differentiated 7nm chip fabricator ahead of major rivals.
0.71
半导体2026/09/23@TechDesk
TSMC's Dresden Fab (ESMC) Tops Out
TSMC…European Semiconductor Manufacturing Company (ESMC) GmbH, Robert-Bosch-Ring, Hellerau/Wilschdorf, 01109 Dresden, Saxony, Germany
开始于 2026/09/14 10:00已确认可信度 80%9天前Focus Taiwan^[1]: "A topping out ceremony was held Monday at the site" (dateline Sept. 14, "The ceremony, held on Sept. 14"); dpa's preview gave the time: ESMC "feiert ... am Montag (12.00 Uhr) mit einem Richtfest den Abschluss des Rohbaus" - noon CEST, 10:00 UTC.
Twenty-five months after its groundbreaking, ESMC - TSMC's joint venture with Bosch, Infineon and NXP - celebrated the topping-out of its roughly EUR 10 billion chip fab in Dresden, TSMC's first in Europe. The shell is finished; cleanroom fit-out follows, with the first process tools due in the second half of 2027.
€10B
0.70
半导体2026/09/23@LawDesk
Taiwan Indicts Three Engineers Over the Theft of TSMC's 2nm Secrets
Intellectual Property Branch, Taiwan High Prosecutors Office, 164 Bo'ai Road, Zhongzheng District, Taipei 100006, Taiwan
开始于 2025/08/27已确认可信度 85%1.1年前The Intellectual Property Branch's own release, posted 114-08-27 (27 August 2025), says the case against the three detained defendants 'was concluded today (27th)' ('於今（27）日偵查終結') and an indictment filed; no time is given, so it is an all-day date.^[1]
Prosecutors charged former TSMC engineer Chen Li-ming, by then at Tokyo Electron's Taiwan unit, and two serving TSMC engineers with stealing 2nm trade secrets, seeking 14, 9 and 7 years in Taiwan's first indictment for theft of a national core key technology.
0.69
半导体2026/09/20@BuildDesk
TSMC's Second Arizona Fab Starts Mass Production
TSMC Arizona campus, N 43rd Avenue at W Dove Valley Road, Phoenix, AZ 85085TSMC
开始于 2027/07/01预估可信度 72%281天后TSMC^[2] said it had "pushed up the mass production schedule for its second wafer fab in the U.S. state of Arizona to the second half of 2027 from the previously planned 2028," naming a half-year rather than a day.
The second fab on TSMC's north Phoenix campus, whose structure was finished in 2025, is due to begin high-volume manufacturing in the second half of 2027 - a year earlier than the schedule the company had previously given. Chairman C.C. Wei gave the pulled-forward date on 15 January 2026; the campus is the centrepiece of a $165 billion Arizona investment.
0.68
半导体2026/09/23@TechDesk
US and Taiwan Sign a $250 Billion Chip Investment Deal
TSMC…U.S. Department of Commerce, 1401 Constitution Avenue Northwest, Washington, DC 20230, United States
开始于 2026/01/15已确认可信度 86%251天前CNBC^[1], published 15 January 2026: 'The U.S. and Taiwan have reached a trade agreement ... the Department of Commerce announced Thursday'; USTR's^[2] February fact sheet dates the 'Memorandum of Understanding signed by AIT and TECRO on January 15, 2026'. No signing time is given, so it is an all-day date.
A memorandum signed in Washington commits Taiwanese chipmakers such as TSMC to at least $250 billion of new US investment plus $250 billion in Taiwan credit guarantees, in return for a 15% tariff cap and Section 232 chip-tariff exemptions for companies building US fabs.
0.68
半导体2026/09/15@BuildDesk
Bosch Opens €1 Billion Chip Fab in Dresden
Dresden-Hellerau, Dresden, GermanyBosch
开始于 2021/06/07已确认可信度 90%5.3年前Bosch's own media release, "Bosch opens chip factory of the future in Dresden," states the fab was opened on 7 June 2021.^[1]
Bosch opened its new 300mm wafer fab in Dresden, a roughly €1 billion, highly automated plant producing sensors and microchips for cars and consumer electronics.
0.67
半导体2026/09/20@BuildDesk
Texas Instruments Starts Production at Its Sherman SM1 Fab
Texas Instruments Sherman site, US-75 at Shepherd Road, Sherman, TX 75090, United StatesTexas Instruments…
开始于 2025/12/17已确认可信度 90%280天前TI's news release is dated "17 DEC 2025" and announces that it "begins production at its newest 300mm semiconductor manufacturing facility in Sherman, Texas".^[1]
TI began production at SM1, the first 300mm wafer fab on its site off US-75 at Shepherd Road in Sherman, three and a half years after breaking ground. The site is laid out for up to four connected fabs and is meant to support as many as 3,000 direct jobs; TI is spending more than $60 billion across seven fabs in Texas and Utah.
0.67

TSMC's^[1][2] 2nm page says N2 "has started volume production in 4Q25 as planned" and its 2025 annual report that it "entered high volume manufacturing in 4Q'25"; neither names the day, so the quarter's last day stands in.

开始: 2025年12月31日可信度 50%来自来源

TSMC Starts Volume Production of 2nm (N2) Chips in Kaohsiung

TSMC's first nanosheet-transistor node, N2, entered volume production in the fourth quarter of 2025 as planned, starting at Fab 22 in Kaohsiung, with Fab 20 in Hsinchu as its second 2nm fab.

TSMC says its 2nm (N2) technology "has started volume production in 4Q25 as planned", and names Fab 20 (Hsinchu) and Fab 22 (Kaohsiung) as its 2nm production facilities^[1]
N2 is TSMC's first node with nanosheet (gate-all-around) transistors, backed by a low-resistance redistribution layer and super-high-performance MiM capacitors; N2P follows, with volume production scheduled for the second half of 2026^[1]
TSMC's 2025 annual report says N2 entered high-volume manufacturing in 4Q'25 "with good yield" and expects "a fast ramp in 2026"^[2]
Production began at Fab 22 near Kaohsiung rather than at Fab 20 beside TSMC's Hsinchu R&D center, where it had been expected to start^[3][5]
Against N3E, N2 gives 10-15% more speed at the same power or 25-30% less power at the same speed, and about 15% more transistor density for mixed logic, analog and SRAM designs^[4][5]
TSMC announced the milestone quietly, with an update to its technology page rather than a press release^[3][4]

@TechDesk

参考资料 5可信度 73%

第一项始终是图钉的来源。总体可信度是各份资料对上方所用开始和结束时间支持程度的加权平均；资料每比最新的一份旧 180 天，权重减半。

[1]50%
tsmc.com/english/dedicatedFoundry/technology/logic/l_2nm
tsmc.com· 发布于 2026年9月23日· 开始 2025年12月31日 ✓· 占评分 33%
TSMC's^[2] 2nm page says N2 "has started volume production in 4Q25 as planned" and its 2025 annual report that it "entered high volume manufacturing in 4Q'25"; neither names the day, so the quarter's last day stands in.
[2]90%
TSMC 2025 Annual Report
investor.tsmc.com· 添加于 2026年9月23日· 占评分 33%
TSMC's^[1] own annual report states "Our 2-nanometer technology successfully entered high volume manufacturing in 4Q'25, with good yield, and we expect a fast ramp in 2026."
[3]80%
TSMC officially begins 2nm chip volume production in Q4 2025
taipeitimes.com· 发表于 2025年12月31日· 占评分 12%
The Taipei Times (CNA) says TSMC^[1][2] "officially began volume production of its 2-nanometer chips in the fourth quarter of 2025", that production is "centered at Fab 22 in Kaohsiung", and that the website update was the first official confirmation.
[4]75%
TSMC's 2nm N2 process officially enters volume production
techspot.com· 发表于 2025年12月30日· 占评分 12%
TechSpot notes TSMC^[1][2] disclosed the milestone on its website rather than in a press release, "fulfilling its goal to begin production in the fourth quarter of 2025", with fabrication starting at Kaohsiung.
[5]82%
TSMC begins quietly volume production of 2nm-class chips
tomshardware.com· 发表于 2025年12月29日· 占评分 12%
Tom's Hardware reports TSMC^[1][2] began N2 volume production "as planned" in 4Q25, at Fab 22 near Kaohsiung rather than Fab 20 near Hsinchu as expected, and lists N2's gains over N3E.

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半导体2026/09/23@TechDesk
TSMC's Second Kumamoto Fab (JASM) Starts 3nm Volume Production
TSMC…JASM, Haramizu, Kikuyo, Kikuchi County, Kumamoto Prefecture 869-1103, Japan
开始于 2028/12/31预估延期12个月可信度 71%2.3年后Only a year is given: Taiwan's MOEA says the fab is "scheduled to start installing equipment and come online in 2028", and C.C. Wei said on the 16 April 2026 call that "commercial production is scheduled to begin in 2028" - so the year's last day, estimated.^[1]
JASM's second fab in Kikuyo, Kumamoto - switched from 6nm-class chips to TSMC's 3nm process - is due to start volume production in 2028 at 15,000 12-inch wafers a month, making Japan's first 3nm chips about a year after the end-2027 start TSMC first promised.
$17B
0.79
半导体2026/09/23@TechDesk
TSMC's 1.6nm-Class A16 Process Enters Volume Production
TSMC…TSMC headquarters, 8 Lixing 6th Road, Baoshan, Hsinchu County 30082, Taiwan
开始于 2027/12/31已延期延期12个月可信度 67%1.3年后TSMC's^[2][5] Kevin Zhang told Tom's Hardware "A16 will be ready for production in 2026... we expect volume production to begin in 2027", and TSMC's roadmap slide lists A16 under 2027; with no quarter named, the year's last day stands in.
A16, TSMC's first node with Super Power Rail backside power delivery, is expected to reach volume production in 2027, a year after the 2026 production TSMC planned when it unveiled the node.
0.74
半导体2026/09/23@TechDesk
TSMC's Third Arizona Fab Starts Volume Production on N2 and A16
TSMC…P3, TSMC Arizona Fab 21, F Road, North Gateway, Phoenix, Maricopa County, Arizona 85085, United States
开始于 2029/12/31预估可信度 58%3.3年后TSMC's^[1][4] Arizona page gives only a span: "Third Fab: In April 2025, TSMC broke ground on the site of the third fab, slated for N2 and A16 process technologies. Targeting volume production by the end of the decade." - so the decade's last day, estimated.
The third fab on TSMC's north Phoenix campus, where ground was broken in April 2025, is slated for its 2nm (N2) and A16 processes and targeted for volume production by the end of the decade - the most advanced chipmaking TSMC has committed to the United States.
0.74
半导体2026/09/23@TechDesk
TSMC's Dresden Fab (ESMC) Starts Production
TSMC…European Semiconductor Manufacturing Company (ESMC) GmbH, Robert-Bosch-Ring, Hellerau/Wilschdorf, 01109 Dresden, Saxony, Germany
开始于 2027/12/31预估可信度 73%1.3年后TSMC's^[1][6] founding release gives a bound, not a day: "production targeted to begin by the end of 2027"; at the September 2026 topping-out the partners still said production starts in 2027 and Hardwareluxx^[3] reported tool installation "bis Ende 2027", after which the first chips follow - so 31 December 2027, estimated.
ESMC, TSMC's EUR 10 billion joint venture with Bosch, Infineon and NXP, is due to start production at its Dresden fab by the end of 2027 - Europe's first FinFET-capable foundry, making 28/22nm and 16/12nm chips mainly for cars and industry.
€10B
0.73
半导体2017/06/21@ThePinGang
In December last year TSMC started to work on its 5nm process
TSMC
开始于 2020/03/31 已确认可信度 79%6.5年前Happened as dated, per hexus.net^[1]: "…progress of these plans, with a target launch date set for H1 2020. Now a recent report suggests th…"
In December last year TSMC started to work on its 5nm process. In the following January we heard from the firm's CEO about the progress of these plans, with a target launch date set for H1 2020. Now a recent report suggests that TSMC is confident of reaching its previously publicised goals, as it has started to allocate between 300 and 400 R&D staff to work on developing its 3nm process.
0.72
半导体2017/06/21@ThePinGang
GLOBALFOUNDRIES will jump directly from 14nm to 7nm
GLOBALFOUNDRIES…
开始于 2018/03/30 已确认可信度 79%8.5年前Happened as dated, per hexus.net^[1]: "…xf Add to My Vault: GLOBALFOUNDRIES has announced that it plans to power straight through to 7nm Fin…"
Tech expected to be ready for chip designers in H2 2017, production in early 2018. It will skip "the marginal performance and power benefits for the high cost of the 10nm process node" to hopefully become a leading differentiated 7nm chip fabricator ahead of major rivals.
0.71
半导体2026/09/23@TechDesk
TSMC's Dresden Fab (ESMC) Tops Out
TSMC…European Semiconductor Manufacturing Company (ESMC) GmbH, Robert-Bosch-Ring, Hellerau/Wilschdorf, 01109 Dresden, Saxony, Germany
开始于 2026/09/14 10:00已确认可信度 80%9天前Focus Taiwan^[1]: "A topping out ceremony was held Monday at the site" (dateline Sept. 14, "The ceremony, held on Sept. 14"); dpa's preview gave the time: ESMC "feiert ... am Montag (12.00 Uhr) mit einem Richtfest den Abschluss des Rohbaus" - noon CEST, 10:00 UTC.
Twenty-five months after its groundbreaking, ESMC - TSMC's joint venture with Bosch, Infineon and NXP - celebrated the topping-out of its roughly EUR 10 billion chip fab in Dresden, TSMC's first in Europe. The shell is finished; cleanroom fit-out follows, with the first process tools due in the second half of 2027.
€10B
0.70
半导体2026/09/23@LawDesk
Taiwan Indicts Three Engineers Over the Theft of TSMC's 2nm Secrets
Intellectual Property Branch, Taiwan High Prosecutors Office, 164 Bo'ai Road, Zhongzheng District, Taipei 100006, Taiwan
开始于 2025/08/27已确认可信度 85%1.1年前The Intellectual Property Branch's own release, posted 114-08-27 (27 August 2025), says the case against the three detained defendants 'was concluded today (27th)' ('於今（27）日偵查終結') and an indictment filed; no time is given, so it is an all-day date.^[1]
Prosecutors charged former TSMC engineer Chen Li-ming, by then at Tokyo Electron's Taiwan unit, and two serving TSMC engineers with stealing 2nm trade secrets, seeking 14, 9 and 7 years in Taiwan's first indictment for theft of a national core key technology.
0.69
半导体2026/09/20@BuildDesk
TSMC's Second Arizona Fab Starts Mass Production
TSMC Arizona campus, N 43rd Avenue at W Dove Valley Road, Phoenix, AZ 85085TSMC
开始于 2027/07/01预估可信度 72%281天后TSMC^[2] said it had "pushed up the mass production schedule for its second wafer fab in the U.S. state of Arizona to the second half of 2027 from the previously planned 2028," naming a half-year rather than a day.
The second fab on TSMC's north Phoenix campus, whose structure was finished in 2025, is due to begin high-volume manufacturing in the second half of 2027 - a year earlier than the schedule the company had previously given. Chairman C.C. Wei gave the pulled-forward date on 15 January 2026; the campus is the centrepiece of a $165 billion Arizona investment.
0.68
半导体2026/09/23@TechDesk
US and Taiwan Sign a $250 Billion Chip Investment Deal
TSMC…U.S. Department of Commerce, 1401 Constitution Avenue Northwest, Washington, DC 20230, United States
开始于 2026/01/15已确认可信度 86%251天前CNBC^[1], published 15 January 2026: 'The U.S. and Taiwan have reached a trade agreement ... the Department of Commerce announced Thursday'; USTR's^[2] February fact sheet dates the 'Memorandum of Understanding signed by AIT and TECRO on January 15, 2026'. No signing time is given, so it is an all-day date.
A memorandum signed in Washington commits Taiwanese chipmakers such as TSMC to at least $250 billion of new US investment plus $250 billion in Taiwan credit guarantees, in return for a 15% tariff cap and Section 232 chip-tariff exemptions for companies building US fabs.
0.68
半导体2026/09/15@BuildDesk
Bosch Opens €1 Billion Chip Fab in Dresden
Dresden-Hellerau, Dresden, GermanyBosch
开始于 2021/06/07已确认可信度 90%5.3年前Bosch's own media release, "Bosch opens chip factory of the future in Dresden," states the fab was opened on 7 June 2021.^[1]
Bosch opened its new 300mm wafer fab in Dresden, a roughly €1 billion, highly automated plant producing sensors and microchips for cars and consumer electronics.
0.67
半导体2026/09/20@BuildDesk
Texas Instruments Starts Production at Its Sherman SM1 Fab
Texas Instruments Sherman site, US-75 at Shepherd Road, Sherman, TX 75090, United StatesTexas Instruments…
开始于 2025/12/17已确认可信度 90%280天前TI's news release is dated "17 DEC 2025" and announces that it "begins production at its newest 300mm semiconductor manufacturing facility in Sherman, Texas".^[1]
TI began production at SM1, the first 300mm wafer fab on its site off US-75 at Shepherd Road in Sherman, three and a half years after breaking ground. The site is laid out for up to four connected fabs and is meant to support as many as 3,000 direct jobs; TI is spending more than $60 billion across seven fabs in Texas and Utah.
0.67

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参考资料 5可信度 73%

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