半导体2026/09/23@TechDesk
TSMC Starts Volume Production of 2nm (N2) Chips in Kaohsiung
TSMC…TSMC Fab22 P1, 園區北路, Nanzi District, Kaohsiung 811, Taiwan
开始于 2025/12/31预估可信度 73%266天前TSMC's^[1][2] 2nm page says N2 "has started volume production in 4Q25 as planned" and its 2025 annual report that it "entered high volume manufacturing in 4Q'25"; neither names the day, so the quarter's last day stands in.
TSMC's first nanosheet-transistor node, N2, entered volume production in the fourth quarter of 2025 as planned, starting at Fab 22 in Kaohsiung, with Fab 20 in Hsinchu as its second 2nm fab.
0.76
半导体2026/09/23@TechDesk
TSMC's Third Arizona Fab Starts Volume Production on N2 and A16
TSMC…P3, TSMC Arizona Fab 21, F Road, North Gateway, Phoenix, Maricopa County, Arizona 85085, United States
开始于 2029/12/31预估可信度 58%3.3年后TSMC's^[1][4] Arizona page gives only a span: "Third Fab: In April 2025, TSMC broke ground on the site of the third fab, slated for N2 and A16 process technologies. Targeting volume production by the end of the decade." - so the decade's last day, estimated.
The third fab on TSMC's north Phoenix campus, where ground was broken in April 2025, is slated for its 2nm (N2) and A16 processes and targeted for volume production by the end of the decade - the most advanced chipmaking TSMC has committed to the United States.
0.75
半导体2026/09/23@TechDesk
TSMC's Second Kumamoto Fab (JASM) Starts 3nm Volume Production
TSMC…JASM, Haramizu, Kikuyo, Kikuchi County, Kumamoto Prefecture 869-1103, Japan
开始于 2028/12/31预估延期12个月可信度 71%2.3年后Only a year is given: Taiwan's MOEA says the fab is "scheduled to start installing equipment and come online in 2028", and C.C. Wei said on the 16 April 2026 call that "commercial production is scheduled to begin in 2028" - so the year's last day, estimated.^[1]
JASM's second fab in Kikuyo, Kumamoto - switched from 6nm-class chips to TSMC's 3nm process - is due to start volume production in 2028 at 15,000 12-inch wafers a month, making Japan's first 3nm chips about a year after the end-2027 start TSMC first promised.
$17B
0.72
半导体2017/06/21@ThePinGang
In December last year TSMC started to work on its 5nm process
TSMC
开始于 2020/03/31 已确认可信度 79%6.5年前Happened as dated, per hexus.net^[1]: "…progress of these plans, with a target launch date set for H1 2020. Now a recent report suggests th…"
In December last year TSMC started to work on its 5nm process. In the following January we heard from the firm's CEO about the progress of these plans, with a target launch date set for H1 2020. Now a recent report suggests that TSMC is confident of reaching its previously publicised goals, as it has started to allocate between 300 and 400 R&D staff to work on developing its 3nm process.
0.71
半导体2026/09/23@TechDesk
TSMC 2026 North America Technology Symposium in Santa Clara
TSMC…Santa Clara Convention Center, 5001 Great America Parkway, Santa Clara, CA 95054, United States
开始于 2026/04/22 15:30已确认可信度 85%154天前TSMC's^[1] release is datelined "SANTA CLARA, CA, Apr. 22, 2026" and says it "today debuted" A13 at the symposium; GUC's event page gives "8:30 a.m. - 5:30 p.m. (PDT, UTC-7)" at the Santa Clara Convention Center.
TSMC's largest annual customer event opened its 2026 series at the Santa Clara Convention Center on 22 April, where it debuted the A13 process, previewed A12 and introduced N2U.
0.71
半导体2026/09/20@BuildDesk
TSMC's Second Arizona Fab Starts Mass Production
TSMC Arizona campus, N 43rd Avenue at W Dove Valley Road, Phoenix, AZ 85085TSMC
开始于 2027/07/01预估可信度 72%281天后TSMC^[2] said it had "pushed up the mass production schedule for its second wafer fab in the U.S. state of Arizona to the second half of 2027 from the previously planned 2028," naming a half-year rather than a day.
The second fab on TSMC's north Phoenix campus, whose structure was finished in 2025, is due to begin high-volume manufacturing in the second half of 2027 - a year earlier than the schedule the company had previously given. Chairman C.C. Wei gave the pulled-forward date on 15 January 2026; the campus is the centrepiece of a $165 billion Arizona investment.
0.68
半导体2026/09/23@TechDesk
TSMC's Dresden Fab (ESMC) Starts Production
TSMC…European Semiconductor Manufacturing Company (ESMC) GmbH, Robert-Bosch-Ring, Hellerau/Wilschdorf, 01109 Dresden, Saxony, Germany
开始于 2027/12/31预估可信度 73%1.3年后TSMC's^[1][6] founding release gives a bound, not a day: "production targeted to begin by the end of 2027"; at the September 2026 topping-out the partners still said production starts in 2027 and Hardwareluxx^[3] reported tool installation "bis Ende 2027", after which the first chips follow - so 31 December 2027, estimated.
ESMC, TSMC's EUR 10 billion joint venture with Bosch, Infineon and NXP, is due to start production at its Dresden fab by the end of 2027 - Europe's first FinFET-capable foundry, making 28/22nm and 16/12nm chips mainly for cars and industry.
€10B
0.67
半导体2026/09/23@LawDesk
Taiwan Indicts Three Engineers Over the Theft of TSMC's 2nm Secrets
Intellectual Property Branch, Taiwan High Prosecutors Office, 164 Bo'ai Road, Zhongzheng District, Taipei 100006, Taiwan
开始于 2025/08/27已确认可信度 85%1.1年前The Intellectual Property Branch's own release, posted 114-08-27 (27 August 2025), says the case against the three detained defendants 'was concluded today (27th)' ('於今（27）日偵查終結') and an indictment filed; no time is given, so it is an all-day date.^[1]
Prosecutors charged former TSMC engineer Chen Li-ming, by then at Tokyo Electron's Taiwan unit, and two serving TSMC engineers with stealing 2nm trade secrets, seeking 14, 9 and 7 years in Taiwan's first indictment for theft of a national core key technology.
0.66
半导体2026/09/23@TechDesk
TSMC Q2 2026 Results: Record $40.2B Revenue, Capex Raised to $60-64B
TSMC…Mandarin Oriental Taipei, 158 Dunhua North Road, Songshan District, Taipei 10548, Taiwan
开始于 2026/07/16 6:00已确认可信度 86%69天前TSMC's^[1][2] release, datelined "HSINCHU, Taiwan, R.O.C., Jul. 16, 2026", says TSMC "today announced" its second-quarter results, and the call transcript TSMC posts gives "EVENT DATE/TIME: JULY 16, 2026 / 6:00AM GMT" (2 p.m. Taiwan time, as the FTNN report of TSMC's schedule says: "16日下午2時").
TSMC reported second-quarter revenue of US$40.20 billion, up 33.7% from a year earlier, a 67.7% gross margin and record net income of NT$706.56 billion, guided Q3 revenue to US$44.6-45.8 billion and raised its 2026 capital budget to US$60-64 billion.
0.65
采矿2026/09/15@BuildDesk
Polymetal Installs Its Record 1,100-Tonne Gold Autoclave at Amursk
Amursk, Khabarovsk Krai, RussiaPolymetal International
开始于 2020/08/17已确认可信度 87%6.1年前International Mining reported on 17 August 2020 that Polymetal's 1,100-tonne autoclave vessel had been installed on schedule at the Amursk POX-2 site.^[1]
Belgian engineering firm Coek Engineering built the world's largest gold-processing autoclave, a 1,100-tonne titanium-lined pressure vessel, and shipped it 25,000 km from Antwerp to Polymetal's Amursk POX-2 plant in Russia's Far East. The vessel was installed on schedule in August 2020.
0.65
交通2026/09/15@BuildDesk
Scheuerle Debuts the Self-Propelled Modular Transporter
Scheuerle Fahrzeugfabrik, Pfedelbach, GermanyScheuerle Fahrzeugfabrik
1983/01/01至1983/12/31预估可信度 65%43.7年前TII Group’s^[3] own "an invention turns 40" retrospective names 1983 as the year Scheuerle developed and launched the SPMT, but gives no specific day.
German heavy-vehicle maker Scheuerle Fahrzeugfabrik developed and launched the Self-Propelled Modular Transporter (SPMT), the modular, multi-axle hauler that became the industry standard for moving exceptionally heavy loads. Its name is now used generically across the heavy-transport industry.
0.64
半导体2017/08/02@ThePinGang
New iPad Pro's A10X Chip Revealed as First Manufactured Using TSMC's 10nm Process
Apple…
开始于 2017/06/13 已确认可信度 78%9.3年前Happened as dated, per macrumors.com^[1][5]: "…ured Using TSMC's 10nm Process With the launch of the new iPad Pro models at WWDC this year, Apple i…"
With the launch of the new iPad Pro models at WWDC this year, Apple introduced new 10.5-inch and 12.9-inch devices that both came with an A10X Fusion Chip, which is said to deliver 30 percent faster CPU performance than previous-generation iPad Pro models and 40 percent faster graphics performance. In comparison, the A9 and A10 were built using a 16-nanometer process, the A8 used a 20-nanometer process, and the A7 used a 28-nanometer process.
0.64

延期12个月

TSMC's^[2][5] Kevin Zhang told Tom's Hardware "A16 will be ready for production in 2026... we expect volume production to begin in 2027", and TSMC's roadmap slide lists A16 under 2027; with no quarter named, the year's last day stands in.

最初承诺于2026/12/31；现已推迟12个月。 Stated: TSMC unveiled A16 in April 2024 "for planned production in 2026"; its 2026 roadmap moves volume production to 2027 because "actual product ramp depends on customers" - about a year late.

开始: 2027年12月31日可信度 40%可信度低来自来源

TSMC's 1.6nm-Class A16 Process Enters Volume Production

A16, TSMC's first node with Super Power Rail backside power delivery, is expected to reach volume production in 2027, a year after the 2026 production TSMC planned when it unveiled the node.

TSMC's 2026 roadmap lists A16 as a 2027 technology; Kevin Zhang said "A16 will be ready for production in 2026. However, actual product ramp depends on customers, and we expect volume production to begin in 2027"^[1]
A16 is essentially N2P with Super Power Rail backside power delivery, aimed at AI and HPC data-center chips; A12, due in 2029, succeeds it^[1]
Moving power rails to the back of the wafer frees front-side routing for signals and cuts IR drop; against N2P, A16 gives 8-10% more speed at the same Vdd, 15-20% less power at the same speed and up to 1.10x chip density^[2]
TSMC's A16 page still says the node "will be production-ready in 2H26"^[2]
TSMC unveiled A16 at its 2024 North America Technology Symposium "for planned production in 2026"^[5], and in November 2024 said it remained on track for late 2026^[4]
TrendForce reads the 2026 roadmap as A16 volume production "delayed to 2027"^[3]

@TechDesk

参考资料 5可信度 67%

第一项始终是图钉的来源。总体可信度是各份资料对上方所用开始和结束时间支持程度的加权平均；资料每比最新的一份旧 180 天，权重减半。

[1]40%
tomshardware.com/tech-industry/semiconductors/tsmc-unveils-process-technology-roadmap-through-2029-a12-a13-n2u-announced-a16-slips-to-2027
tomshardware.com· 发布于 2026年9月23日· 开始 2027年12月31日 ✓· 占评分 38%
TSMC's^[2][5] Kevin Zhang told Tom's Hardware "A16 will be ready for production in 2026... we expect volume production to begin in 2027", and TSMC's roadmap slide lists A16 under 2027; with no quarter named, the year's last day stands in.
[2]85%
A16 Technology - TSMC
tsmc.com· 添加于 2026年9月23日· 占评分 38%
TSMC's^[5] own A16 page describes the Super Power Rail node and its gains over N2P and says "A16 will be production-ready in 2H26" - ready, not in volume production.
[3]80%
TSMC Latest Roadmap: A12, A13 for 2029 Without High-NA EUV; A16 Volume Production Delayed to 2027
trendforce.com· 发表于 2026年4月23日· 占评分 21%
TrendForce reports that "A16 volume production is now slated for 2027, marking a delay from its previously expected 2026 timeline".
[4]72%
TSMC's says 1.6nm node to be production ready in late 2026 - roadmap remains on track
tomshardware.com· 发表于 2024年11月22日· 占评分 3%
In November 2024 TSMC^[2][5] told Tom's Hardware A16 was on track to be ready for high-volume manufacturing in late 2026 - the earlier plan, since superseded.
[5]75%
TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership
pr.tsmc.com· 发表于 2024年4月24日· 占评分 1%
TSMC's^[2] April 2024 release debuted A16 "for planned production in 2026" - the original date the pin's delay is measured from.

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半导体2026/09/23@TechDesk
TSMC Starts Volume Production of 2nm (N2) Chips in Kaohsiung
TSMC…TSMC Fab22 P1, 園區北路, Nanzi District, Kaohsiung 811, Taiwan
开始于 2025/12/31预估可信度 73%266天前TSMC's^[1][2] 2nm page says N2 "has started volume production in 4Q25 as planned" and its 2025 annual report that it "entered high volume manufacturing in 4Q'25"; neither names the day, so the quarter's last day stands in.
TSMC's first nanosheet-transistor node, N2, entered volume production in the fourth quarter of 2025 as planned, starting at Fab 22 in Kaohsiung, with Fab 20 in Hsinchu as its second 2nm fab.
0.76
半导体2026/09/23@TechDesk
TSMC's Third Arizona Fab Starts Volume Production on N2 and A16
TSMC…P3, TSMC Arizona Fab 21, F Road, North Gateway, Phoenix, Maricopa County, Arizona 85085, United States
开始于 2029/12/31预估可信度 58%3.3年后TSMC's^[1][4] Arizona page gives only a span: "Third Fab: In April 2025, TSMC broke ground on the site of the third fab, slated for N2 and A16 process technologies. Targeting volume production by the end of the decade." - so the decade's last day, estimated.
The third fab on TSMC's north Phoenix campus, where ground was broken in April 2025, is slated for its 2nm (N2) and A16 processes and targeted for volume production by the end of the decade - the most advanced chipmaking TSMC has committed to the United States.
0.75
半导体2026/09/23@TechDesk
TSMC's Second Kumamoto Fab (JASM) Starts 3nm Volume Production
TSMC…JASM, Haramizu, Kikuyo, Kikuchi County, Kumamoto Prefecture 869-1103, Japan
开始于 2028/12/31预估延期12个月可信度 71%2.3年后Only a year is given: Taiwan's MOEA says the fab is "scheduled to start installing equipment and come online in 2028", and C.C. Wei said on the 16 April 2026 call that "commercial production is scheduled to begin in 2028" - so the year's last day, estimated.^[1]
JASM's second fab in Kikuyo, Kumamoto - switched from 6nm-class chips to TSMC's 3nm process - is due to start volume production in 2028 at 15,000 12-inch wafers a month, making Japan's first 3nm chips about a year after the end-2027 start TSMC first promised.
$17B
0.72
半导体2017/06/21@ThePinGang
In December last year TSMC started to work on its 5nm process
TSMC
开始于 2020/03/31 已确认可信度 79%6.5年前Happened as dated, per hexus.net^[1]: "…progress of these plans, with a target launch date set for H1 2020. Now a recent report suggests th…"
In December last year TSMC started to work on its 5nm process. In the following January we heard from the firm's CEO about the progress of these plans, with a target launch date set for H1 2020. Now a recent report suggests that TSMC is confident of reaching its previously publicised goals, as it has started to allocate between 300 and 400 R&D staff to work on developing its 3nm process.
0.71
半导体2026/09/23@TechDesk
TSMC 2026 North America Technology Symposium in Santa Clara
TSMC…Santa Clara Convention Center, 5001 Great America Parkway, Santa Clara, CA 95054, United States
开始于 2026/04/22 15:30已确认可信度 85%154天前TSMC's^[1] release is datelined "SANTA CLARA, CA, Apr. 22, 2026" and says it "today debuted" A13 at the symposium; GUC's event page gives "8:30 a.m. - 5:30 p.m. (PDT, UTC-7)" at the Santa Clara Convention Center.
TSMC's largest annual customer event opened its 2026 series at the Santa Clara Convention Center on 22 April, where it debuted the A13 process, previewed A12 and introduced N2U.
0.71
半导体2026/09/20@BuildDesk
TSMC's Second Arizona Fab Starts Mass Production
TSMC Arizona campus, N 43rd Avenue at W Dove Valley Road, Phoenix, AZ 85085TSMC
开始于 2027/07/01预估可信度 72%281天后TSMC^[2] said it had "pushed up the mass production schedule for its second wafer fab in the U.S. state of Arizona to the second half of 2027 from the previously planned 2028," naming a half-year rather than a day.
The second fab on TSMC's north Phoenix campus, whose structure was finished in 2025, is due to begin high-volume manufacturing in the second half of 2027 - a year earlier than the schedule the company had previously given. Chairman C.C. Wei gave the pulled-forward date on 15 January 2026; the campus is the centrepiece of a $165 billion Arizona investment.
0.68
半导体2026/09/23@TechDesk
TSMC's Dresden Fab (ESMC) Starts Production
TSMC…European Semiconductor Manufacturing Company (ESMC) GmbH, Robert-Bosch-Ring, Hellerau/Wilschdorf, 01109 Dresden, Saxony, Germany
开始于 2027/12/31预估可信度 73%1.3年后TSMC's^[1][6] founding release gives a bound, not a day: "production targeted to begin by the end of 2027"; at the September 2026 topping-out the partners still said production starts in 2027 and Hardwareluxx^[3] reported tool installation "bis Ende 2027", after which the first chips follow - so 31 December 2027, estimated.
ESMC, TSMC's EUR 10 billion joint venture with Bosch, Infineon and NXP, is due to start production at its Dresden fab by the end of 2027 - Europe's first FinFET-capable foundry, making 28/22nm and 16/12nm chips mainly for cars and industry.
€10B
0.67
半导体2026/09/23@LawDesk
Taiwan Indicts Three Engineers Over the Theft of TSMC's 2nm Secrets
Intellectual Property Branch, Taiwan High Prosecutors Office, 164 Bo'ai Road, Zhongzheng District, Taipei 100006, Taiwan
开始于 2025/08/27已确认可信度 85%1.1年前The Intellectual Property Branch's own release, posted 114-08-27 (27 August 2025), says the case against the three detained defendants 'was concluded today (27th)' ('於今（27）日偵查終結') and an indictment filed; no time is given, so it is an all-day date.^[1]
Prosecutors charged former TSMC engineer Chen Li-ming, by then at Tokyo Electron's Taiwan unit, and two serving TSMC engineers with stealing 2nm trade secrets, seeking 14, 9 and 7 years in Taiwan's first indictment for theft of a national core key technology.
0.66
半导体2026/09/23@TechDesk
TSMC Q2 2026 Results: Record $40.2B Revenue, Capex Raised to $60-64B
TSMC…Mandarin Oriental Taipei, 158 Dunhua North Road, Songshan District, Taipei 10548, Taiwan
开始于 2026/07/16 6:00已确认可信度 86%69天前TSMC's^[1][2] release, datelined "HSINCHU, Taiwan, R.O.C., Jul. 16, 2026", says TSMC "today announced" its second-quarter results, and the call transcript TSMC posts gives "EVENT DATE/TIME: JULY 16, 2026 / 6:00AM GMT" (2 p.m. Taiwan time, as the FTNN report of TSMC's schedule says: "16日下午2時").
TSMC reported second-quarter revenue of US$40.20 billion, up 33.7% from a year earlier, a 67.7% gross margin and record net income of NT$706.56 billion, guided Q3 revenue to US$44.6-45.8 billion and raised its 2026 capital budget to US$60-64 billion.
0.65
采矿2026/09/15@BuildDesk
Polymetal Installs Its Record 1,100-Tonne Gold Autoclave at Amursk
Amursk, Khabarovsk Krai, RussiaPolymetal International
开始于 2020/08/17已确认可信度 87%6.1年前International Mining reported on 17 August 2020 that Polymetal's 1,100-tonne autoclave vessel had been installed on schedule at the Amursk POX-2 site.^[1]
Belgian engineering firm Coek Engineering built the world's largest gold-processing autoclave, a 1,100-tonne titanium-lined pressure vessel, and shipped it 25,000 km from Antwerp to Polymetal's Amursk POX-2 plant in Russia's Far East. The vessel was installed on schedule in August 2020.
0.65
交通2026/09/15@BuildDesk
Scheuerle Debuts the Self-Propelled Modular Transporter
Scheuerle Fahrzeugfabrik, Pfedelbach, GermanyScheuerle Fahrzeugfabrik
1983/01/01至1983/12/31预估可信度 65%43.7年前TII Group’s^[3] own "an invention turns 40" retrospective names 1983 as the year Scheuerle developed and launched the SPMT, but gives no specific day.
German heavy-vehicle maker Scheuerle Fahrzeugfabrik developed and launched the Self-Propelled Modular Transporter (SPMT), the modular, multi-axle hauler that became the industry standard for moving exceptionally heavy loads. Its name is now used generically across the heavy-transport industry.
0.64
半导体2017/08/02@ThePinGang
New iPad Pro's A10X Chip Revealed as First Manufactured Using TSMC's 10nm Process
Apple…
开始于 2017/06/13 已确认可信度 78%9.3年前Happened as dated, per macrumors.com^[1][5]: "…ured Using TSMC's 10nm Process With the launch of the new iPad Pro models at WWDC this year, Apple i…"
With the launch of the new iPad Pro models at WWDC this year, Apple introduced new 10.5-inch and 12.9-inch devices that both came with an A10X Fusion Chip, which is said to deliver 30 percent faster CPU performance than previous-generation iPad Pro models and 40 percent faster graphics performance. In comparison, the A9 and A10 were built using a 16-nanometer process, the A8 used a 20-nanometer process, and the A7 used a 28-nanometer process.
0.64

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参考资料 5可信度 67%

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