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Intel and AMD are joining forces to produce new 8th-Generation H-Series Intel mobile processors paired with stacked second-generation High Bandwidth Memory and custom-built discrete graphics from AMD. For the new H-Series chips, which feature all of the above listed components in a single processor package, Intel says is using its Embedded Multi-Die Interconnect Bridge (EMIB), a power-sharing framework that reduces the standard silicon footprint to less than half that of standard discrete components on a motherboard. This is the first consumer product that takes advantage of EMIB.