Épingles correspondant à tag:TSMC

Prosecutors charged former TSMC engineer Chen Li-ming, by then at Tokyo Electron's Taiwan unit, and two serving TSMC engineers with stealing 2nm trade secrets, seeking 14, 9 and 7 years in Taiwan's first indictment for theft of a national core key technology.

TSMC's first nanosheet-transistor node, N2, entered volume production in the fourth quarter of 2025 as planned, starting at Fab 22 in Kaohsiung, with Fab 20 in Hsinchu as its second 2nm fab.

A memorandum signed in Washington commits Taiwanese chipmakers such as TSMC to at least $250 billion of new US investment plus $250 billion in Taiwan credit guarantees, in return for a 15% tariff cap and Section 232 chip-tariff exemptions for companies building US fabs.

TSMC's largest annual customer event opened its 2026 series at the Santa Clara Convention Center on 22 April, where it debuted the A13 process, previewed A12 and introduced N2U.

Taiwan's Intellectual Property and Commercial Court jailed Chen Li-ming for 10 years, three TSMC engineers for 2 to 6 years, and fined Tokyo Electron's Taiwan unit NT$150 million - the first verdict under the National Security Act's core-technology clause.

TSMC reported second-quarter revenue of US$40.20 billion, up 33.7% from a year earlier, a 67.7% gross margin and record net income of NT$706.56 billion, guided Q3 revenue to US$44.6-45.8 billion and raised its 2026 capital budget to US$60-64 billion.

Taiwan's Supreme Court dismissed the appeals of Chen Li-ming and Chen Wei-chieh, making their 10- and 6-year sentences for leaking TSMC's 2nm and 14nm secrets final; both go straight to prison.

Twenty-five months after its groundbreaking, ESMC - TSMC's joint venture with Bosch, Infineon and NXP - celebrated the topping-out of its roughly EUR 10 billion chip fab in Dresden, TSMC's first in Europe. The shell is finished; cleanroom fit-out follows, with the first process tools due in the second half of 2027.

Le 18e Open Innovation Platform Ecosystem Forum de TSMC réunit concepteurs de puces, partenaires EDA et IP et clients au Santa Clara Convention Center le 23 septembre, ouvrant une série mondiale qui s'achèvera en Israël en décembre.

TSMC reports third-quarter 2026 results and gives its fourth-quarter outlook at its earnings conference on Thursday 15 October at 2 p.m. Taiwan time, against its own guidance of US$44.6-45.8 billion in revenue and a 65-67% gross margin.

A16, TSMC's first node with Super Power Rail backside power delivery, is expected to reach volume production in 2027, a year after the 2026 production TSMC planned when it unveiled the node.

ESMC, TSMC's EUR 10 billion joint venture with Bosch, Infineon and NXP, is due to start production at its Dresden fab by the end of 2027 - Europe's first FinFET-capable foundry, making 28/22nm and 16/12nm chips mainly for cars and industry.

JASM's second fab in Kikuyo, Kumamoto - switched from 6nm-class chips to TSMC's 3nm process - is due to start volume production in 2028 at 15,000 12-inch wafers a month, making Japan's first 3nm chips about a year after the end-2027 start TSMC first promised.

The third fab on TSMC's north Phoenix campus, where ground was broken in April 2025, is slated for its 2nm (N2) and A16 processes and targeted for volume production by the end of the decade - the most advanced chipmaking TSMC has committed to the United States.